Optical device package and optical semiconductor device using the same

An optical semiconductor device comprising:

• an optical device package including;
• a metal base including a substrate with a predetermined outer shape and a die pad portion integrally connected to the substrate, the substrate and the die pad portion being a single piece of a metal plate, the substrate having two opposed principal surfaces, and the die pad portion being bent with respect to and transverse to the two opposed principal surfaces of the substrate,
• a first lead electrode intersecting and transverse to the two opposed principal surfaces of the substrate of the metal base, and spaced apart from the metal base, wherein each end of the first lead electrode protrudes from a respective one of the two opposed principal surfaces of the substrate, and
• a resin seal member including a plate-like base portion extending across and in contact with one of the two opposed principal surfaces of the substrate of the metal base, the first lead electrode extending in an opposite direction from the die pad portion, relative to the direction that the substrate protrudes from the base portion, the resin seal member covering the first lead electrode in the same direction as the die pad portion relative to the substrate, leaving an exposed surface portion, and securing the metal base and the first lead electrode in a fixed relationship to each other;
• and
• a semiconductor laser device mounted on a mount disposed on a surface of the die pad portion of the metal base, and having electrodes electrically connected to said first lead electrodes or to both of said first and second lead electrodes.