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US 7,622,733 B2Granted
Semiconductor structure with a plastic housing and separable carrier plate
AssigneeInfineon Technologies AG
InventorsEdward Fuergut, Thomas Kalin, Holger Woerner, Carsten Von Koblinski
Life of this patent
Estimating the term…
Abstract
A semiconductor structure includes: a carrier plate; a thermosensitive adhesive coupled to a top surface of the carrier plate, which is removable from the carrier plate at a predetermined, defined temperature at which the thermosensitive adhesive loses its adhesive action; semiconductor chips having active top surfaces and back surfaces, where the active top surfaces include contact surfaces disposed on the thermosensitive adhesive; and a plastic embedding compound on the carrier plate, in which the semiconductor chips are embedded.
Claims18
A semiconductor structure, comprising:
- a earner plate;
- a thermosensitive adhesive coupled to a top surface of the carrier plate, the thermosensitive adhesive being removable from the carrier plate at a predetermined, defined temperature at which the thermosensitive adhesive loses its adhesive action;
- a plurality of semiconductor chips having active top surfaces and back surfaces, the active top surfaces including contact surfaces disposed on the thermosensitive adhesive;
- a common carrier comprising a plastic embedding compound on the carrier plate, the semiconductor chips being embedded in the plastic embedding compound;
- and
- an adhesive film laminated to the top surface of the carrier plate, the adhesive film being provided with the thermosensitive adhesive on a side facing away from the carrier plate and being provided with a permanent adhesive on a side facing the carrier plate.
3 more elements
A semiconductor structure, comprising:
- a carrier plate;
- a thermosensitive adhesive coupled to a top surface of the carrier plate, the thermosensitive adhesive being removable from the carrier plate at a predetermined, defined temperature at which the thermosensitive adhesive loses its adhesive action;
- a plurality of semiconductor chips having active top surfaces and back surfaces, the active top surfaces including contact surfaces disposed on the thermosensitive adhesive;
- a common carrier comprising a plastic embedding compound on the carrier plate, the semiconductor chips being embedded in the plastic embedding compound;
- and
- an adhesive film laminated to the top surface of the carrier plate, the adhesive film including a permanent adhesive on a side facing away from the carrier plate and including the thermosensitive adhesive on a side facing the carrier plate.
3 more elements
A semiconductor structure, comprising:
- a earner plate;
- a plurality of semiconductor chips having active top surfaces and back surfaces, the active top surfaces including contact surfaces;
- a common carrier comprising a plastic embedding compound on the carrier plate, the semiconductor chips being embedded in the plastic embedding compound;
- a thermosensitive adhesive disposed between the carrier plate and the plastic embedding compound of the common carrier, wherein the contact surfaces of the semiconductor chips are disposed on the thermosensitive adhesive and the thermosensitive adhesive is removable from the carrier plate at a predetermined, defined temperature at which the thermosensitive adhesive loses its adhesive action;
- and
- an adhesive film laminated to the top surface of the carrier plate, the adhesive film including a permanent adhesive on a side facing away from the carrier plate and including the thermosensitive adhesive on a side facing the carrier plate.
3 more elements
A semiconductor structure, comprising:
- a carrier plate;
- a plurality of semiconductor chips having active top surfaces and back surfaces, the active top surfaces including contact surfaces;
- a common carrier comprising a plastic embedding compound on the carrier plate, the semiconductor chips being embedded in the plastic embedding compound;
- a thermosensitive adhesive disposed between the carrier plate and the plastic embedding compound of the common carrier, wherein the contact surfaces of the semiconductor chips are disposed on the thermosensitive adhesive and the thermosensitive adhesive is removable from the carrier plate at a predetermined, defined temperature at which the thermosensitive adhesive loses its adhesive action;
- and
- an adhesive film laminated to the top surface of the carrier plate, the adhesive film being provided with the thermosensitive adhesive on a side facing away from the carrier plate and being provided with a permanent adhesive on a side facing the carrier plate.
3 more elements
Dependencies are inferred from the claim text.