CMOS flat X-ray detector
AssigneeSiemens Aktiengesellschaft
InventorMartin Spahn
Life of this patent
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Abstract
A large-area CMOS flat X-ray detector is disclosed. The detector includes a plurality of CMOS detector chips, mounted on a substrate with a butt joint. Two alternative embodiments of the CMOS detector chips are described. In the first embodiment, drive elements and read elements are provided on two of four edges of the chip. If the connecting lines are routed to the first edge, this allows an embodiment in which more than four such CMOS detector chips are fitted alongside one another. In one alternative embodiment, all the drives and read operations can be carried out from a first edge so that at least six such CMOS detector chips can be adhesively bonded on the substrate alongside one another.
Claims13
A CMOS flat X-ray detector, comprising:
- a plurality of CMOS detector chips, mounted on a substrate with a butt joint;
- drive elements configured to drive detector element columns on a chip, the drive elements being provided on a first edge on each rectangular CMOS detector chip;
- read elements for line-by-line reading of detector elements, provided on a second edge at right angles to the first edge;
- and
- detector elements provided on third and fourth edges of the chip, wherein
- the CMOS detector chips are arranged like shingles on one another, with one section of one detector chip, on which detectors are arranged, being located above one section of an adjacent other detector chip, on which read elements are arranged, in such a manner that a closed sequence of detector elements is seen in a plan view of the detector, and
- an X-ray converter is arranged on the shingle-like arrangement, with filling material for matching to a horizontally planar lower face of the X-ray converter being provided between the X-ray converter and the chip.
A CMOS flat X-ray detector, comprising:
- a plurality of CMOS detector chips, mounted on a substrate with a butt joint;
- drive elements configured for driving detector element columns on a chip, provided on a first edge on each rectangular CMOS detector chip;
- read elements for line-by-line reading of detector elements, provided on a second edge at right angles to the first edge;
- and
- detector elements provided on third and fourth edges of the chips, wherein
- the read elements are read via a multiplexer on the chip, whose connecting lines are accessible from the first edge,
- the CMOS detector chips are arranged like shingles on one another, with one section of one detector chip, on which detectors are arranged, being located above one section of an adjacent other detector chip, on which read elements are arranged, in such a manner that a closed sequence of detector elements is seen in a plan view of the detector, and
- an X-ray converter is arranged on the shingle-like arrangement, with filling material for matching to a horizontally planar lower face of the X-ray converter being provided between the X-ray converter and the chip.
A CMOS flat X-ray detector, comprising:
- a plurality of CMOS detector chips, mounted on a substrate with a butt joint;
- drive elements and read elements, provided on only one edge of the rectangular CMOS detector chips;
- detector elements, provided on a second to a fourth edge of the chips;
- and
- a logic element, provided for each detector element, to allow clocked driving of the detector elements line-by-line from the first edge, wherein a multiplexer on the first edge controls the column-by-column reading when being clocked, wherein
- the CMOS detector chips are arranged like shingles on one another, with one section of one detector chip, on which detectors are arranged, being located above one section of an adjacent other detector chip, on which read elements are arranged, in such a manner that a closed sequence of detector elements is seen in a plan view of the detector, and
- an X-ray converter is arranged on the shingle-like arrangement, with filling material for matching to a horizontally planar lower face of the X-ray converter being provided between the X-ray converter and the chip.
Dependencies are inferred from the claim text.