Electronic component package
AssigneePanasonic Corporation
InventorsAtsushi Takano, Mitsuhiro Furukawa
Life of this patent
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Abstract
An electronic component package comprises: an electronic component where device elements are mounted inside cavities formed between a component substrate and a component cover that covers the component substrate; and a mounting substrate. The component cover is placed on the mounting substrate, and the electronic component is mounted on the mounting substrate and molded by a resin. At least one of a ground electrode and a dummy electrode is provided on a surface of the component cover, the surface being placed on the mounting substrate. At least one of the ground electrode and the dummy electrode is provided in a position opposed to at least part of the cavities.
Claims16
An electronic component package, comprising:
- a mounting substrate;
- an external electrode arranged on the mounting substrate;
- an electronic component mounted via the external electrode;
- and
- a mold resin coating the electronic component on the mounting substrate, wherein
- the electronic component has a component substrate, a device element arranged on a first surface of the component substrate, and a component cover which covers the first surface of the component substrate and forms a cavity at a portion of the device element, and
- at least one of a ground electrode and a dummy electrode is provided at a portion facing to the cavity, which is formed at an opposite side surface of the electronic component, of the component cover.
Dependencies are inferred from the claim text.