Composition of epoxy and anhydride components, antioxidant and phosphor material
AssigneeHenkel Corporation
InventorDale Starkey
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Abstract
A molding compound is provided for use in encapsulating electronic packages which include an optoelectronic component, such as an LED. The molding compound includes a partially cured epoxy composition, an antioxidant, and, optionally, a phosphor material substantially uniformly distributed throughout the epoxy composition. The optional phosphor material may be suspended within the epoxy composition by pre-reacting a portion of the epoxy composition prior to B-staging of the molding compound. As such, the optional phosphor material is suspended within the epoxy composition, thereby preventing settling of the phosphor material during B-staging, as well as during curing of the molding compound in the encapsulation process.
Claims20
A molding composition, comprising a reaction product obtained through partial curing of the following:
- a) an epoxy composition comprising the reaction product of:
- i) an epoxy resin, and
- ii) an anhydride component;
- b) an antioxidant material;
- and
- c) a visible light-emitting phosphor material substantially uniformly distributed throughout said molding composition through initial partial curing of said epoxy composition of component a) to suspend said phosphor material of component c) therein prior to partial curing of said reaction product of components a), b) and c).
Dependencies are inferred from the claim text.