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US 7,622,378 B2Granted
Multi-step system and method for curing a dielectric film
AssigneeTokyo Electron Limited
InventorsJunjun Liu, Eric M. Lee, Dorel L. Toma
Life of this patent
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Abstract
A multi-step system and method for curing a dielectric film in which the system includes a drying system configured to reduce the amount of contaminants, such as moisture, in the dielectric film. The system further includes a curing system coupled to the drying system, and configured to treat the dielectric film with ultraviolet (UV) radiation and infrared (IR) radiation in order to cure the dielectric film.
Claims24
A processing system for treating a dielectric film on a substrate, comprising:
- a drying system configured to perform a drying process to reduce the amount of contaminants in or on said dielectric film;
- a curing system coupled to said drying system and configured to perform a curing process, said curing system comprising two or more radiation source groupings, each grouping dedicated to a specific radiation wave-band, the two or more radiation source groupings being disposed facing a same side of the substrate and including,
- an ultraviolet (UV) radiation source configured to expose said dielectric film to UV radiation, and
- an infrared (IR) radiation source configured to expose said dielectric film to IR radiation;
- and
- a transfer system coupled to said drying system and said curing system, and configured to exchange said substrate between said drying system and said curing system under vacuum conditions.
3 more elements
Dependencies are inferred from the claim text.