Method for manufacturing a thin film transistor device

A method for manufacturing a semiconductor device comprising:

• forming a first semiconductor film in a peripheral circuit region and a second semiconductor film in a pixel region over a substrate;
• forming a pair of first impurity regions and a pair of second impurity regions in the first semiconductor film, wherein one of the pair of first impurity regions is in physical contact with one of the pair of second impurity regions;
• forming a pair of third impurity regions in the second semiconductor film;
• and
• forming a wiring electrically connected to the one of the pair of first impurity regions and the one of the pair of second impurity regions.

A method for manufacturing a semiconductor device comprising:

• forming a first semiconductor film in a peripheral circuit region and a second semiconductor film in a pixel region over a substrate;
• forming a gate insulating film over the first semiconductor film and the second semiconductor film;
• forming a first gate electrode and a second gate electrode over the first semiconductor film and the gate insulating film, and a third gate electrode over the second semiconductor film and the gate insulating film;
• selectively doping a N-type impurity into the first semiconductor film and the second semiconductor film;
• covering the second semiconductor film and a portion of the first semiconductor film by a photoresist;
• selectively doping a P-type impurity into a portion of the first semiconductor film which is not covered by the photoresist, whereby a pair of first impurity regions and a pair of second impurity regions are formed in the first semiconductor film and a pair of third impurity regions are formed in the second semiconductor film, and one of the pair of first impurity regions is in physical contact with one of the pair of second impurity regions;
• and
• forming a wiring electrically connected to the one of the pair of first impurity regions and the one of the pair of second impurity regions.

A method for manufacturing a semiconductor device comprising:

• forming a first semiconductor film in a peripheral circuit region and a second semiconductor film in a pixel region over a substrate;
• selectively doping a N-type impurity into the first semiconductor film and the second semiconductor film,
• covering the second semiconductor film and a portion of the first semiconductor film by a photoresist,
• selectively doping a P-type impurity into a portion of the first semiconductor film which is not covered by the photoresist, whereby a pair of first impurity regions and a pair of second impurity regions are formed in the first semiconductor film and a pair of third impurity regions are formed in the second semiconductor film, and one of the pair of first impurity regions is in physical contact with one of the pair of second impurity regions, and
• forming a wiring electrically connected to the one of the pair of first impurity regions and the one of the pair of second impurity regions.