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US 7,622,327 B2Granted
Covered devices in a semiconductor package
AssigneeIntel Corporation
InventorsGregory M. Chrysler, Tony A. Opheim
Life of this patent
Estimating the term…
Abstract
An embodiment of the present invention is a technique to fabricate a cover assembly. A cover has a base plate and sidewalls attached to perimeter of the base plate. The sidewalls have a height. A plurality of devices is attached to underside of the base plate. The devices have length corresponding to the height such that the devices are sealed within the cover when the cover is attached to a surface.
Claims12
A method comprising:
- forming a cover having a base plate and sidewalls attached to perimeter of the base plate, the sidewalls having a height;
- attaching a plurality of devices to underside of the base plate, the devices having length corresponding to the height;
- and
- attaching the cover to a surface after attaching the devices to the underside of the base plate such that the devices are sealed within the cover;
- wherein attaching the plurality of devices comprises:
- attaching the plurality of devices, the devices being thin film thermo-electric coolers (TFTECs).
3 more elements
Dependencies are inferred from the claim text.