Integrated circuit package system including high-density small footprint system-in-package
AssigneeSTATS ChipPAC, Ltd.
InventorsIL Kwon Shim, Tsz Yin Ho, Dario S. Filoteo, Jr., Seng Guan Chow
Life of this patent
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Abstract
An integrated circuit package system including a high-density small footprint system-in-package with a substrate is provided. Passive components are mounted on the substrate. Solder separators are provided on the substrate, the solder separators having flattened tops at a predetermined height above the substrate. A die is supported on the solder separators above the substrate.
Claims20
A method of making an integrated circuit package system including a high-density small footprint system-in-package, comprising:
- providing a substrate;
- providing solder separators on the substrate, the solder separators having flattened tops at a predetermined height above the substrate;
- coupling a backside of a die, electrically and thermally, through the solder separators to the substrate;
- mounting passive components on the substrate under the die in the predetermined height.
A method of making an integrated circuit package system including a high-density small footprint system-in-package, comprising:
- providing a substrate;
- providing solder separators on the substrate, the solder separators having flattened tops at a predetermined height above the substrate;
- dispensing a conductive adhesive on the tops of the flattened tops;
- surface mounting passive components on the substrate in the predetermined height;
- coupling a backside of a die, electrically and thermally, to the conductive adhesive and supporting the die on the solder separators, above the substrate and the passive components;
- curing the conductive adhesive;
- wire bonding the die to the substrate;
- encapsulating the substrate, the passive components, and the die in a molding compound;
- and
- singulating the encapsulated die, passive components, and substrate to form a package.
An integrated circuit package system including a high-density small footprint system-in-package, comprising:
- a substrate;
- solder separators on the substrate, the solder separators having flattened tops at a predetermined height above the substrate;
- a die coupled, electrically and thermally, on the backside through the solder separators to the substrate;
- passive components mounted on the substrate under the die in the predetermined height.
An integrated circuit package system including a high-density small footprint system-in-package, comprising:
- a substrate;
- solder separators on the substrate, the solder separators having flattened tops at a predetermined height above the substrate;
- passive components surface mounted on the substrate in the predetermined height;
- cured conductive adhesive on the tops of the flattened tops;
- a die coupled electrically and thermally by the backside to the cured conductive adhesive and supported on the solder separators, above the substrate and the passive components;
- the die being wire bonded to the substrate;
- a molding compound encapsulating the substrate, the passive components, and the die;
- and
- the encapsulated die, passive components, and substrate being singulated to form a package.
Dependencies are inferred from the claim text.