Fabrication of three dimensional integrated circuit employing multiple die panels

A method of assembling of an electronic device, comprising:

• dividing a first wafer having a plurality of die into a set of multiple-die panels, wherein a panel includes an M×N array of a first sets of dies, wherein each panel of the set of multiple-die panels includes a plurality of the die from the first wafer;
• testing a second wafer comprising a plurality of second sets of dies to identify the location of functional second sets of dies within the second wafer;
• determining panel sites of the second wafer, wherein the panel sites include an M×N array of second sets of dies, wherein determining the panel sites of the second wafer comprises selecting panel sites to maximize the number of panel sites having a panel site yield exceeding a specified threshold wherein a panel site yield indicates the number of functional second sets of dies in a panel site;
• binning the panel sites of the second wafer into one of multiple bins, wherein each bin is associated with a corresponding pattern of functional second die within the panel site;
• bonding a panel to a panel site of a second wafer to form a panel stack;
• and
• sawing the panel stack into a set of electronic devices, each electronic device comprising a first die bonded to a second die.

A method of assembling an electronic device, comprising:

• sawing a first wafer having a plurality of first sets of dies into a panel comprising an M×N array of first die, wherein either M or N is greater than 1, wherein each panel includes a plurality of first sets of dies;
• forming a panel site by bonding the panel to a panel site of a second wafer having a plurality of second sets of dies, wherein the panel site encompasses an M×N array of the second sets of dies;
• testing the first wafer to identify functional first sets of dies and testing the second wafer to identify functional second sets of dies;
• selecting a panel and a corresponding panel site for bonding based upon a matching pattern of functional die in the panel and the panel site;
• and
• sawing the panel site into a device comprising a first sets of dies from the panel bonded to a second sets of dies from the panel site.