Inspection of underfill in integrated circuit package
AssigneeAdvanced Micro Devices, Inc.
InventorsKeng Sang Cha, Tek Seng Tan, Haris Fazelah, Ahmad Zahrain B. Mohamad Shakir
Life of this patent
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Abstract
In inspecting for quality of underfill material dispensed in an IC package, a camera image is captured for the IC package having the underfill material dispensed between an IC die and a package substrate. A data processor analyzes the camera image to determine an occurrence of an unacceptable condition of the underfill material. Pre-heating and/or post-heating of the package substrate before and/or after dispensing the underfill material by a contact-less heater ensures uniform spreading of the underfill material.
Claims22
A method of inspecting for quality of underfill material dispensed in an IC (integrated circuit) package, comprising:
- generating a camera image of the IC package having the underfill material dispensed between an IC die and a package substrate;
- analyzing, by a data processor, the camera image of an underfill fillet formed to a sidewall of the IC die to determine an occurrence of an unacceptable condition of the underfill material;
- determining by the data processor a fillet width of said underfill fillet from the camera image;
- and
- determining by the data processor a height of the underfill fillet along the sidewall of the IC die from the fillet width.
A method of inspecting for quality of underfill material dispensed in an IC (integrated circuit) package, comprising:
- generating a camera image of the IC package having the underfill material dispensed between an IC die and a package substrate;
- analyzing, by a data processor, the camera image to determine an occurrence of an unacceptable condition of the underfill material;
- positioning the IC package at a tilted angle with respect to a vertical axis of a camera;
- and
- capturing the camera image of a side of the IC package with the camera.
Dependencies are inferred from the claim text.