Silicon substrate for magnetic recording medium and magnetic recording medium
AssigneeShowa Denko K.K.
InventorsKatsuaki Aida, Hiroyuki Machida, Kazuyuki Haneda
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AssigneeShowa Denko K.K.
InventorsKatsuaki Aida, Hiroyuki Machida, Kazuyuki Haneda
Estimating the term…
To provide a substrate which is not substantially chipped or cracked on the substrate end faces even when the substrate is a silicon substrate made of a brittle material, and provide a substrate which prevents dust raising from the substrate end faces and prevents dust raising due to rubbing with a processing cassette. A silicon substrate for a magnetic recording medium is formed by setting the lengths L of chamfered portions between the main surfaces of the substrate and the outer circumferential side end face to 0.1±0.03 mm and setting the angles α between the main surfaces and the chamfered portions between the main surfaces and the outer circumferential side end face to 45 degrees ±5 degrees. It is also possible for a curved portion with a radius of 0.01 mm or more and less than 0.3 mm is interposed between the main surfaces and the outer circumferential side chamfered portions of the substrate.
A silicon substrate for a magnetic recording medium, provided with chamfered portions between main surfaces and an end face of the substrate, wherein the lengths of the chamfered portions between the main surfaces and an outer circumferential side end face are 0.1±0.03 mm, and the angles between the main surfaces and the chamfered portions between the main surfaces and the outer circumferential side end face are 45 degrees ±5 degrees,
A silicon substrate for a magnetic recording medium, provided with chamfered portions between main surfaces and an end face of the substrate, wherein the lengths of the chamfered portions between the main surfaces and an inner circumferential side end face are 0.1±0.03 mm, and angles between the main surfaces and the chamfered portions between the main surfaces and the inner circumferential side end face are 45 degrees ±5 degrees,
Dependencies are inferred from the claim text.