Retainer ring of chemical mechanical polishing device

#This application makes reference to, incorporates the same herein, and claims all benefits accruing under 35 U.S.C.§ 119 from an application for RETAINER RING OF CHEMICAL MECHANICAL POLISHING APPARATUS earlier filed in the Korean Intellectual Property Office on 16 Jun. 2005 and there duly assigned Serial No. 20-2005-0017397.

#1. Technical Field

#The present invention relates to a retainer ring which is installed to a polishing head of a chemical-mechanical polishing device for processing semiconductor wafers, and more particularly, to a retainer ring of a chemical-mechanical polishing device which can prevent itself from being twisted and improve defective proportion and equipment operating rate occurred when polishing semiconductor wafers by embedding a metal member inside.

#A more complete appreciation of the invention and many of the attendant advantages thereof, will be readily apparent as the same becomes better understood by reference to the following detailed description when considered in conjunction with the accompanying drawings in which like reference symbols indicate the same or similar components, wherein:

#FIG. 1 shows a partial sectional view illustrating a polishing head of a chemical-mechanical polishing device to which a retainer ring according to the first embodiment of the present invention is installed:

#FIG. 2A shows an enlarged sectional view of the retainer ring shown in FIG. 1;

#10: polishing head 20: polishing pad 30: semiconductor wafer 110: carrier 120: retainer ring 122: first member 124: second member 130: vacuum duct 140: membrane

#According to an aspect of the present invention, a retainer ring installed to a polishing head of a chemical mechanical polishing device to fix a semiconductor wafer is provided. The retainer ring includes:

#a first member made of resin and connected to a carrier of the polishing head and a room is formed inside;