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US 7,621,974 B2Granted
Bonding structure and bonding method for cemented carbide element and diamond element, cutting tip and cutting element for drilling tool, and drilling tool
AssigneeMitsubishi Materials Corporation
InventorsKazuo Yamamoto, Tadakazu Ohashi, Akhmadi Wardoyo
Life of this patent
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Abstract
A cutting tip for a drilling tool includes a cemented carbide cutting base, a diamond element supported by the cutting base, and a bonding layer formed between the cutting base and the diamond element in order to bond them. The bonding layer includes diffusion layers and in which one or two or more metals selected from a group consisting of Fe, Ni, Co, Ti, Zr, W, V, Nb, Ta, Cr, Mo, and Hf diffuses into at least one of the diamond or the cement carbide.
Claims5
A cutting tip, comprising:
- a cemented carbide cutting base;
- a diamond element supported by said cutting base;
- and
- a bonding layer formed between said cutting base and said diamond element in order to bond them;
- wherein said bonding layer includes a diffusion layer in which one or two or more metals selected from a group consisting of Fe, Ni, Co, Ti, Zr, W, V, Nb, Ta, Cr, Mo, and Hf diffuses into at least one of said cemented carbide or said diamond, and
- when a cross-section in a transverse direction of said bonding layer is line analyzed using EPMA, the maximum value of a content of said metals in said cross section is 20 times or greater than an average value of a content of said metals in a region of the cemented carbide element not influenced by the diffusion, and 100 times or greater than an average value of a content of said metal in a region of said diamond element not influenced by the diffusion.
3 more elements
Dependencies are inferred from the claim text.