Reducing polishing pad deformation
AssigneeApplied Materials, Inc.
InventorsDoyle E. Bennett, Boguslaw A. Swedek, David J. Lischka
Life of this patent
Estimating the term…
Abstract
A chemical mechanical polishing pad is described. A chemical mechanical polishing pad has an outer layer that includes a polishing surface, a first thinned region defined by a recess on a bottom surface of the pad, a first thick region surrounding the first thinned region, a second thinned region surrounding the first thick region, and a second thick region surrounding the second thinned region. The first thick region is not vertically extendable. The second thinned region defines one or more flexure mechanisms configured to make the first thinned region and the first thick region movable relative to the second thick region in a direction parallel or substantially parallel to the polishing surface.
Claims16
A chemical mechanical polishing pad, comprising:
- an outer layer that includes a polishing surface, a thinned region defined by a recess on a bottom surface of the pad, a first thick region surrounding the thinned region, the first thick region not vertically extendable, a second thick region surrounding the first thick region, and a third thick region surrounding the second thick region, the second thick region defining one or more compression mechanisms configured to make the thinned region and the first thick region movable relative to the third thick region in a direction parallel or substantially parallel to the polishing surface, wherein the thinned region and the first thick region are part of a window in the outer layer and the one or more compression mechanisms are integrated into the outer layer and abut the window, wherein the one or more compression mechanisms allow the window to move in a direction parallel or substantially parallel to the polishing surface, and wherein the one or more compression mechanisms and the outer layer are made of different materials.
A method for polishing pad fabrication, the method comprising:
- forming a window having a thickness;
- forming a recess and one or more slots in the window, the recess formed on a bottom surface of the window, the recess defining a first thinned region in the window, the window including a thick region surrounding the first thinned region, the thick region not vertically extendable, the slots being of a depth that is less than the thickness of the window, the slots defining a second thinned region in the window, the second thinned region surrounding the thick region, the second thinned region being one or more flexure mechanisms configured to make the first thinned region and the thick region movable in a direction parallel or substantially parallel to a top surface of the polishing pad;
- and
- securing the window to an outer layer of a polishing pad.
A method for polishing pad fabrication, the method comprising:
- forming a window having a thickness;
- forming a recess in the window, the recess formed on a bottom surface of the window, the recess defining a thinned region in the window, the window including a first thick region surrounding the thinned region, the first thick region not vertically extendable;
- forming a band of compressible material that surrounds the first thick region of the window, the band of compressible material defining a second thick region, the band of compressible material configured to make the window movable in a direction parallel or substantially parallel to a top surface of the polishing pad;
- and
- securing the window with the band of compressible material to an outer layer of a polishing pad.
Dependencies are inferred from the claim text.