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US 7,621,759 B2Granted
Electronic apparatus and method of manufacturing electronic apparatus
AssigneeDenso Corporation
InventorsDai Ito, Takayoshi Honda
Life of this patent
Estimating the term…
Abstract
An electronic apparatus is disclosed that includes a board and an electronic component having a body. The board has multiple through-holes and multiple lands covering multiple through-holes. The electronic component has multiple terminals. The terminals are respectively coupled with the lands while a part of each terminal being inserted into a through-hole. A shape of the through-hole is generally circular and different from a part of the land on a back surface of the board. The part of the land on the back surface has a width and the width is different in directions.
Claims17
An electronic apparatus comprising:
- a board having a front surface and a back surface opposite to each other;
- and
- an electronic component including a body made of an insulating material,
- wherein:
- the electronic component further includes a plurality of terminals;
- the plurality of terminals is aligned on the body along a first direction, the first direction being substantially parallel to the front surface of the board;
- each terminal is partially held in the body;
- the board includes a plurality of lands;
- the electronic component is mounted to the board with the body being located on the front surface of the board in such a manner that each terminal is coupled with a corresponding land through a solder;
- the board further has a plurality of through-holes;
- each through-hole has a front open-end on the front surface of the board and a back open-end on the back surface of the board;
- the back open-end of the each through-hole has generally a circular shape;
- each land includes a front land part, a back land part and a side-wall land part integrated together;
- the front land part of the each land surrounds the front open-end of a corresponding through-hole;
- the back land part of the each land surrounds the back open-end of the corresponding through-hole;
- the side-wall land part of the each land is located on a side-wall of the corresponding through-hole;
- the each terminal has an insertion-mounting part that is soldered to the corresponding land while being inserted into the corresponding through-hole;
- a shape of a perimeter of the back land part of the each land is different from the circular shape of the back open-end of the corresponding through-hole;
- the back land part of the each land has:
- a first length defined as a length of a first reference segment, wherein the first reference segment (i) interconnects two points on the perimeter of the back land part, (ii) passes through a center of the corresponding through-hole, and (iii) is substantially parallel to the first direction;
- and
- a second length defined as a length of a second reference segment, wherein the second reference segment (i) interconnects other two points on the perimeter of the back land part, (ii) passes through a center of the corresponding through-hole and (iii) is substantially parallel to a second direction, the second direction being substantially perpendicular to the first direction and substantially parallel to the front surface of the board;
- and
- the first length is different from the second length.
21 more elements
A method for manufacturing an electronic apparatus, comprising:
- applying a solder in the form of paste to a plurality of lands formed in a board, wherein the board has a plurality of through-holes, wherein each land has a front land part, back land part and a side-wall land part integrated together, wherein the front land part of the each land surrounds an open end of a corresponding through-hole on a front surface side of the board, wherein the back land part of the each land surrounds another open end of through-hole on a back surface side of the board, wherein the side-wall land part of the each land is located on a side-wall of the corresponding through-hole;
- placing a first electronic component on the front surface side of the board, wherein the first electronic component has a body made of insulating material and a plurality of terminals partially held in the body;
- and
- performing a first reflow process to connect the each terminal and a corresponding land by applying heat while an part of the each terminal is being inserted into a corresponding through-hole,
- wherein:
- the board is prepared so that that the back land part of the each land has:
- a first length defined as a length of a first reference segment, wherein the first reference segment (i) interconnects two points on the perimeter of the back land part, (ii) passes through a center of the corresponding through-hole, and (iii) is substantially parallel to the first direction;
- and
- a second length defined as a length of a second reference segment, wherein the second reference segment (i) interconnects other two points on the perimeter of the back land part, (ii) passes through a center of the corresponding through-hole, and (iii) is substantially parallel to a second direction, the second direction being substantially perpendicular to the first direction and substantially parallel to the front surface of the board, wherein the first length is different from the second length;
- and
- in the first reflow process:
- the solder in the form of paste is applied to the plurality of lands from the front surface side of the board;
- and
- the heat is applied from both the front and back surface sides of the board.
11 more elements
Dependencies are inferred from the claim text.