Electromagnetic radiation shield for an optical subassembly
AssigneeFinisar Corporation
InventorsGary Landry, Harold Y. Walker, Jr.
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AssigneeFinisar Corporation
InventorsGary Landry, Harold Y. Walker, Jr.
Estimating the term…
In one example embodiment, an electromagnetic radiation (EMR) shield includes a disk, and a substantially centrally located opening defined in the disk. An outside perimeter of the disk is approximately the same as that of a flange of an associated optical subassembly (OSA). The disk defines a plurality of apertures.
An EMR shield comprising:
Dependencies are inferred from the claim text.
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Packages, e.g. shape, construction, internal or external details: bidirectionally operating package structures
Electrical aspects: protection against electromagnetic interference [EMI], e.g. shielding means
Casings: specially adapted for optoelectronic applications
Optical elements, systems or apparatus
About 1 year 7 months of term left · ends 22 May 2028 (estimated)
Optoelectronic modules, such as optoelectronic transceiver or transponder modules, are increasingly used in electronic and optoelectronic communication. Optoelectronic modules generally include one or more optical subassemblies (OSAs), such as a transmitter optical subassembly (TOSA) and/or a receiver optical subassembly (ROSA). Each OSA of an optoelectronic module is generally positioned proximate an optical port of the optoelectronic module. Each optical port is configured to receive an optical fiber connector, such as an LC or an SC connector, such that the corresponding optical fiber is capable of optically and mechanically interfacing with the OSA.
Optoelectronic modules also generally include one or more printed circuit boards having electronic circuitry. The electronic circuitry of a printed circuit board can create electromagnetic radiation (EMR). When EMR is inadvertently emitted from an optoelectronic module, the EMR can cause electromagnetic interference (EMI) in nearby electronic devices which can degrade the functionality of those electronic devices. Therefore, it is important to control the inadvertent emission of EMR from optoelectronic modules. In addition, as host devices are configured to simultaneously interface with increasing numbers of optoelectronic modules, and as data rates of optoelectronic modules increase, the inadvertent emission of EMR becomes increasingly problematic.
Another related problem is the electromagnetic susceptibility (EMS) of optoelectronic modules. The EMS of an optoelectronic module is the degree to which the optoelectronic module is subject to malfunction or failure under the influence of electromagnetic radiation. Therefore, it is also important to control the inadvertent introduction of EMR into optoelectronic modules.
To further clarify certain aspects of the present invention, a more particular description of the invention will be rendered by reference to example embodiments thereof which are disclosed in the appended drawings. It is appreciated that these drawings depict only example embodiments of the invention and are therefore not to be considered limiting of its scope. Aspects of the invention will be described and explained with additional specificity and detail through the use of the accompanying drawings in which:
FIG. 1 is a perspective view of an example optoelectronic module;
FIG. 2A is a perspective view of part of an example optical subassembly (OSA) including an example electromagnetic radiation (EMR) shield;
Example embodiments of the present invention relate to electromagnetic radiation (EMR) shields for use in optical subassemblies (OSAs), such as transmitter optical subassemblies (TOSAs) and/or receiver optical subassemblies (ROSAs). The example EMR shields disclosed herein can aid in controlling the amount of EMR that passes through OSAs in connection with which the EMR shields are employed. These OSAs can, in turn, be effective at limiting the transmission of EMR out of and/or into optoelectronic modules into which the OSAs are integrated, while avoiding the difficulties and costs associated with approaches such as coating OSAs with metal, or forming OSAs from metal.
Reference will now be made to the drawings to describe various aspects of example embodiments of the invention. It is to be understood that the drawings are diagrammatic and schematic representations of such example embodiments, and are not limiting of the present invention, nor are they necessarily drawn to scale.
1. Example Optoelectronic Module