Light-emitting module

#The invention relates to a light-emitting module.

#One object is to specify a light-emitting module that is particularly easy to manufacture.

#According to at least one embodiment of the light-emitting module, the light-emitting module comprises a light source mounted on a carrier. Said light source can be, for example, one or more light-emitting diode (LED) chips.

#Further advantages, preferred embodiments and improvements of the light-emitting module and its constituent parts will emerge from the exemplary embodiment described below in conjunction with the figures. Therein:

#FIG. 1 is a schematic perspective representation of an exemplary embodiment of a light-emitting module comprising a light source, a carrier for the light source, and an optical element, wherein the optical element comprises dowel pins that engage in corresponding recesses in the carrier,

#FIG. 2 is a schematic perspective representation of an exemplary embodiment of a preferably one-piece optical element for the light-emitting module,

#In the exemplary embodiments and figures, like or like-acting elements are provided with the same respective reference numerals. The illustrated elements in the figures are not necessarily to be considered true to scale, but rather, individual elements may be depicted in part as exaggeratedly large for the sake of better understanding.

#FIG. 1 shows a schematic perspective representation of a first exemplary embodiment of the light-emitting module described here. FIG. 1 shows an optical element 1, which is attached to a carrier 8. Said carrier 8 is, for example, a circuit board with conductive traces by means of which the light sources are electrically contacted. The circuit board is, for example, a metal-core board that may contain a material that is a good thermal conductor, such as copper or aluminum.

#The light sources are, for example, LED chips 9. Said LED chips 9 can be placed on a ceramic substrate. The ceramic substrate preferably comprises through-contacts, e.g. vias, by means of which the LED chips 9 are connected electrically conductively to the conductive traces of the carrier. The ceramic substrate then preferably contains at least one of the following materials: aluminum nitrite, aluminum oxide, glass-ceramic, glass, metal.