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AssigneePanasonic Corporation
InventorsKeiji Nishimoto, Hideo Nagai
Estimating the term…
The following explains an LED module that can achieve favorable light extraction efficiency without increasing a cost. An LED module (100) includes LED devices (110), an LED mounting module (120) on which the LED devices (110) are mounted, and a lens board (130) attached to a front surface of the LED mounting module (120). The LED mounting module (120) includes a printed wiring board (123) and a reflecting board (126). The printed wiring board (123) is an insulation board (122) on which a wiring pattern (124), used to mount the LED devices (110), is formed. The reflecting board (126) is made of a resin material, and has therein reflecting holes (126a) provided in correspondence with locations, on the printed wiring board (123), where the LED devices (110) are mounted. The reflecting board (126) and the printed wiring board (123) are directly adhered to each other at their surfaces that face each other.
An LED mounting module for having LED devices which are to be mounted thereon, the LED mounting module comprising:
An LED mounting module for having a plurality of LED devices which are to be mounted thereon, the LED mounting module comprising:
Dependencies are inferred from the claim text.
From the US filing history. Foreign family members aren’t listed.
Drawings are temporarily unavailable. Open the PDF at USPTO
Manufacture or treatment: batch processes
Light sources comprising attachment means: retrofit light sources for lighting devices with a single fitting for each light source, e.g. for…
Planar light sources: comprising a two-dimensional [2D] array of point-like light-generating elements
Light-generating elements of semiconductor light sources: light-emitting diodes [LED]
Term ended 16 Jul 2025 (estimated)
The present invention relates to an LED mounting module, an LED module, a manufacturing method of an LED mounting module, and a manufacturing method of an LED module. An LED mounting module includes a substrate and a reflecting member made of a resin. On one of main surfaces of the substrate, an LED device is to be mounted. The reflecting member has therein a reflecting hole provided in correspondence with a location, on the main surface of the substrate, where the LED device is to be mounted.
In recent years, light emitting diodes (hereinafter referred to as LEDs) attract attention as a next-generation light source for lighting apparatuses. There is a demand for developing energy-saving lighting apparatuses using LEDs, since LEDs have a higher efficiency and a longer lifetime than incandescent and halogen lamps. In particular, with their small size, LEDs are expected to realize small-sized lighting apparatuses.
To use LEDs for lighting apparatuses, a plurality of LED bare chips (hereinafter referred to as LED devices) are mounted on a substrate, thereby forming an LED module, for example.
FIG. 1 is an overall view illustrating a lighting apparatus relating to a first embodiment of the present invention.
FIG. 2 is a perspective view illustrating an LED module relating to the first embodiment.
FIG. 3A is an enlarged cross-sectional view illustrating a part of the LED module in which an LED device is mounted, and FIG. 3B is an enlarged plan view illustrating the part of the LED module without a lens board.
The following describes a lighting apparatus relating to a first embodiment of the present invention, an LED module and an LED mounting module used in the lighting apparatus, and a manufacturing method of the LED mounting module, with reference to the attached drawings.
(1) Lighting Apparatus
1. Construction