US 7,621,310 B2Granted

Apparatus for manufacturing bonded substrate

AssigneeFujitsu Limited

InventorsKoji Hashizume, Yoshimasa Miyajima, Norihiko Hatano, Tetsuji Kadowaki

Life of this patent

Estimating the term…

Loading patent…

Abstract

The present invention provides an apparatus for manufacturing a bonded substrate that suppresses a defect in the bonded substrate. When the pressure in a vacuum chamber is at the atmospheric level, upper and lower chuck units respectively attract substrates through vacuum. When the vacuum chamber is depressurized, each chuck unit electrostatically attracts the associated substrate. During the depressurization of the vacuum chamber, the pressure for attracting each substrate to the associated chuck unit is controlled to be equal to the pressure in the vacuum chamber. This prevents each substrate from falling from or moving relative to the associated chuck unit. The first and second substrates are thus bonded together and accurately aligned.

Claims9

Dependent claims

A bonded substrate manufacturing apparatus for bonding a first substrate and a second substrate together, the apparatus comprising:

a liquid crystal dripping device for dripping liquid crystal on at least either one of the first and second substrates for bonding the first and second substrates together;
a pressing device for bonding the first and second substrates with a seal material in an evacuated treatment chamber to prepare a bonded substrate, the seal material including a photo-curing adhesive;
a hardening device for irradiating light to harden the seal material in the bonded substrate;
a misalignment detection device for detecting misalignment between the first and second substrates in the bonded substrate after the seal material is hardened;
and
a controller coupled to the pressing device, the hardening device and the misalignment detection device and programmed to;
instruct the pressing device to align first and second substrates that are to be bonded in a subsequent operation cycle based on misalignment detected by the misalignment detection device in a previous operation cycle;
determine that a predetermined period has elapsed after the first and second substrates are bonded together;
and
instruct the hardening device to start hardening of the seal material when or after the predetermined period elapses after the first and second substrates are bonded together.

7 more elements

Dependencies are inferred from the claim text.

Facts

Application: 11/418,674Filed 5 May 2006 · continuation
Priority: JP 2000-36458230 Nov 2000
Published: US 2006/0027318 A114 Sep 2006
Granted: 24 Nov 2009
Term ends: Not estimatedThe source records don’t support an estimate.

Classification20 codes

G02F 1/1339
Constructional arrangements; Manufacturing methods: gaskets; Spacers; Sealing of cells
B32B 38/1841
Positioning, e.g. registration or centering: during laying up
G02F 1/1341
Constructional arrangements; Manufacturing methods: filling or closing of cells
B32B 37/12
Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding: characterised by using adhesives

Family

Application09/998,054Parent of this division · filed 30 Nov 2001
Application11/248,741Parent of this continuation · filed 12 Oct 2005
US 2006/0201627 A1Pre-grant publication · published 14 Sep 2006
US 7,300,532 B2Parent of this continuation
US 7,096,911 B2Parent of this division
Application11/248,741Parent of this division
US 2002/0062787 A1Published application
US 2006/0027318 A1Published application
US 7,621,310 B2This patent

From the US filing history. Foreign family members aren’t listed.