Method for mounting electronic components on a substrate

A mounting method of mounting electronic components on a film substrate containing positioning holes, the method comprising:

• forming the positioning holes for inserting and positioning electronic components having different thickness in the film substrate, the positioning holes being formed by punching the film substrate using a press machine;
• providing a positioning jig having concave portions for inserting the electronic components having respective thicknesses thicker than that of the film substrate, in which depths of the concave portions are configured such that, when the electronic components are inserted in the concave portions to be positioned, other surfaces of the electronic components having terminal parts formed thereon are flush with an other surface of the film substrate;
• covering the positioning jig with the film substrate such that the positioning holes correspond to the concave portions of the positioning jig;
• inserting the electronic components into the positioning holes of the film substrate and further into the concave portions of the positioning jig such that one surface of each of the electronic components inserted in the positioning holes protrudes from one surface of the film substrate and the other surfaces of the electronic components are flush with the other surface of the film substrate;
• and
• printing conductive ink on the other surfaces of the electronic components and the film substrate to electrically connect the terminal parts of the electronic components with the film substrate by the conductive ink, and at the same time, the conductive ink flowing into clearances between the electronic components and the plurality of positioning holes to fix the electronic components to the film substrate.