Component mounting apparatus with pivotable transfer mechanism
AssigneeSamsung Techwin Co., Ltd.
InventorsTae-young Lee, Young-soo Hwang
Life of this patent
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AssigneeSamsung Techwin Co., Ltd.
InventorsTae-young Lee, Young-soo Hwang
Estimating the term…
Provided is a component mounter. The component mounter comprises: a bed; a component supply unit; a conveyor transferring at least one PCB to a specified mounting position; a plurality of head units having at least one nozzle for picking up the electronic component from the component supply unit and for mounting it to the PCB; first and second Y axis transfer mechanisms; an X axis transfer mechanism having a first end of mounted to the first Y axis transfer mechanism and the second end mounted to the second Y axis transfer mechanism; a first driving unit controlling the movement of the first end of the X axis transfer mechanism along Y axis; and a second driving unit controlling the movement of the second end of the X axis transfer mechanism along the Y axis, independently of the first driving unit.
An apparatus for mounting components, the apparatus comprising:
Dependencies are inferred from the claim text.