# US 7,613,965 B2 · Apparatus and method for high-speed SAS link protocol testing > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 7,613,965 B2 - Document ID: US7613965B2 - Status: Granted - Kind: B2 - Application number: 12/050,778 - Filed: 2008-03-18 - Published: 2008-07-17 - Granted: 2009-11-03 - Earliest claimed: 2006-06-07 - Assignees: Dell Products L.P. - Inventors: Paul Fuller; Arthur J. Gregorcyk - Web page: https://patentgrep.com/patent/US7613965B2 ## CPC - H05K 1/0292: {having a modifiable lay-out, i.e. adapted for engineering changes or repair (H05K1/0293 takes precedence)} - H05K 1/111: {Pads for surface mounting, e.g. lay-out} - H05K 1/181: associated with surface mounted components - H05K 2201/10015: Non-printed capacitor - H05K 2203/162: Testing a finished product, e.g. heat cycle testing of solder joints - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ## Abstract An apparatus for changing a connection between two serial components on the same circuit board. The apparatus comprises at least one column, and each column includes first, second, third and fourth pads. The first pad communicates with a first breakout connector disposed on the circuit board. The second pad communicates with a second breakout connector disposed on the circuit board. The third pad communicates with one of the serial components. The fourth pad communicates with the other of the serial components and with the third pad during normal operation. ## Claims ### Claim 1 A method for testing a link between two serial components on the same circuit board, the method comprising: providing at least one column, each column including first, second, third and fourth pads; providing a first breakout connector disposed on the circuit board and communicating with the first pad; providing a second breakout connector disposed on the circuit board and communicating with the second pad; connecting the third pad and one of the serial components; connecting the fourth pad with the other of the serial components and with the third pad for normal operation; and establishing a connection between the third pad and the first pad, and between the fourth pad and the second pad. ### Claim 2 (depends on 1) The method of claim 1 wherein the column is disposed on the circuit board between the first breakout connector and the second breakout connector. ### Claim 3 (depends on 1) The method of claim 1 further comprising providing second, third and fourth columns disposed on the circuit board. ### Claim 4 (depends on 1) The method of claim 1 wherein the first pad communicates with a TX/RX pad of the first breakout connector, and the second pad communicates with a TX/RX pad of the second breakout connector. ### Claim 5 (depends on 1) The method of claim 1 wherein the third pad is connected to the first pad with a capacitor. ### Claim 6 (depends on 1) The method of claim 1 wherein the fourth pad is connected to the second pad with a capacitor. ### Claim 7 An apparatus for testing a connection between two serial components on the same circuit board, the apparatus comprising: at least one column, each column including first, second, third and fourth pads; the first pad communicating with a first breakout connector disposed on the circuit board; the second pad communicating with a second breakout connector disposed on the circuit board; the third pad communicating with one of the serial components and with the first pad; and the fourth pad communicating with the other of the serial components and with the second pad. ### Claim 8 (depends on 7) The apparatus of claim 7 wherein the column is disposed on the circuit board between the first breakout connector and the second breakout connector. ### Claim 9 (depends on 7) The apparatus of claim 7 further comprising second, third and fourth columns disposed on the circuit board. ### Claim 10 (depends on 7) The apparatus of claim 7 wherein the first pad communicates with a TX/RX pad of the first breakout connector, and the second pad communicates with a TX/RX pad of the second breakout connector. ### Claim 11 (depends on 7) The apparatus of claim 7 wherein the third pad communicates with the first pad through a capacitor. ### Claim 12 (depends on 7) The apparatus of claim 7 wherein the fourth pad communicates with the second pad through a capacitor. ### Claim 13 A circuit board comprising: a first serial component and a second serial component; a first breakout connector and a second breakout connector; at least one column, each column including first, second, third and fourth pads; the first pad communicating with the first breakout connector; the second pad communicating with the second breakout connector; the third pad communicating with the first serial component and with the first pad; and the fourth pad communicating with the second serial component and with the second pad during normal operation. ### Claim 14 (depends on 13) The circuit board of claim 13 wherein the column is disposed between the first breakout connector and the second breakout connector. ### Claim 15 (depends on 13) The circuit board of claim 13 further comprising second, third and fourth columns. ### Claim 16 (depends on 13) The circuit board of claim 13 wherein the first pad communicates with a TX/RX pad of the first breakout connector, and the second pad communicates with a TX/RX pad of the second breakout connector. ### Claim 17 (depends on 13) The circuit board of claim 13 wherein the third pad communicates with the first pad through a capacitor. ### Claim 18 (depends on 13) The circuit board of claim 13 wherein the fourth pad communicates with the second pad through a capacitor. ### Claim 19 (depends on 13) The circuit board of claim 13 wherein the serial component comprises a serial attached SCSI expander chip.