# US 7,613,008 B2 · Power semiconductor module with capacitors connected parallel to one another

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- Number: US 7,613,008 B2
- Document ID: US7613008B2
- Status: Granted
- Kind: B2
- Application number: 11/603,606
- Filed: 2006-11-22
- Published: 2007-05-24
- Granted: 2009-11-03
- Earliest claimed: 2005-11-22
- Assignees: Semikron Elektronik GmbH & Co. KG
- Inventors: Peter Beckedahl; Ludwig Hager
- Web page: https://patentgrep.com/patent/US7613008B2

## CPC

- H01R 13/22: Contacts for co-operating by abutting
- H10W 72/00: Interconnections or connectors in packages
- H01R 13/6625: {with capacitive component}
- H01R 25/162: {Electrical connections between or with rails or bus-bars (rails having primarily a non electrical function H01R4/64)}
- H01R: ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

A power semiconductor module is presented. The power semiconductor module includes a plurality of capacitors coupled in parallel with each other. Each of the plurality of capacitors each includes a first and a second connection element. The power semiconductor module further includes a first and a second busbar. The first connection element of each of the plurality of capacitors is bonded to the first busbar, and the second connection element of each of the plurality of capacitors is bonded to the second busbar. The power semiconductor module further includes an insulating element disposed between the first busbar and the second busbar, and a pressure assembly that includes at least one pressure body and one associated counterpart pressure body. The first connection element and the second connection element of each of the plurality of capacitors is subjected to pressure and electrically bonded to the associated busbars by the pressure assembly.

## Claims

### Claim 1

A power semiconductor module, comprising:
a plurality of capacitors coupled in parallel with each other, each of the plurality of capacitors comprising a first connection element and a second connection element;
a first busbar and a second busbar, the first connection element of each of the plurality of capacitors being bonded to the first busbar, and the second connection element of each of the plurality of capacitors being bonded to the second busbar;
an insulating element disposed between the first busbar and the second busbar; and
a pressure assembly comprising at least one pressure body and one associated counterpart pressure body, the first connection element and the second connection element of each of the plurality of capacitors being subjected to pressure and electrically bonded to the respective first and second busbars by the pressure assembly.

### Claim 2 (depends on 1)

The power semiconductor module according to claim 1, wherein the at least one pressure body includes elastic first arms and rigid second arms and the associated counterpart pressure body includes rigid portions and elastic portions, the pressure assembly is configured to press each of the first connections between one of the elastic first arms and one of the rigid portions and to press each of the second connections between one of the rigid second arms and one of the elastic portions.

### Claim 3 (depends on 1)

The power semiconductor module according to claim 1, wherein the capacitors are fixed between the pressure body and the counterpart pressure body of the pressure assembly.

### Claim 4 (depends on 1)

The power semiconductor module according to claim 1, wherein the plurality of capacitors are oriented parallel to one another and side by side in one row proximate to the first and second busbars and are disposed at least approximately in the same plane as the first and second busbars.

### Claim 5 (depends on 2)

The power semiconductor module according to claim 2, wherein the elastically embodied portions of the associated counterpart pressure body comprise freestanding element arranged in a groove defined in the counterpart pressure body.

### Claim 6 (depends on 2)

The power semiconductor module according to claim 2, wherein the elastic portions of the counterpart pressure body are disposed below and vertically aligned with the second arms of the at least one pressure body.

### Claim 7 (depends on 3)

The power semiconductor module according to claim 3, further comprising an elongated retaining device oriented parallel to the first and second busbars and protruding away from the pressure body, the elongated retaining device comprising a cushion element.

### Claim 8 (depends on 3)

The power semiconductor module according to claim 3, wherein the counterpart pressure body comprises positioning elements for the plurality of capacitors.

### Claim 9 (depends on 5)

The power semiconductor module according to claim 5, wherein the first and second arms are disposed proximate to each other and extend transversely from a side of the pressure body in a parallel direction.

### Claim 10 (depends on 5)

The power semiconductor module according to claim 5, wherein the first and second arms protrude equidistantly from the side of the pressure body.