# US 7,613,005 B2 · Mounting device for mounting heat sink onto electronic component > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 7,613,005 B2 - Document ID: US7613005B2 - Status: Granted - Kind: B2 - Application number: 12/110,341 - Filed: 2008-04-27 - Published: 2009-10-01 - Granted: 2009-11-03 - Earliest claimed: 2008-03-28 - Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd.; Foxconn Technology Co., Ltd. - Inventors: Jer-Haur Kuo; Xin-Xiang Zha; Ye-Fei Yu; Jun Li; Jun Ding - Web page: https://patentgrep.com/patent/US7613005B2 ## CPC - H10W 40/774: {Pistons, e.g. spring-loaded members} - H10W 40/611: {Bolts or screws} - H10W 40/231: {characterised by their places of attachment or cooling paths} - H10W 40/235: {attached to package parts} - H10W 40/60: Securing means for detachable heating or cooling arrangements, e.g. clamps - H10W 40/625: {Clamping parts not primarily conducting heat} - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract A mounting device (10) for mounting a heat sink (40) onto a printed circuit board (60) with a heat generating electronic component (50) mounted thereon. The mounting device includes a mounting frame (101) and two resilient clips (102) attached to the mounting frame. The mounting frame includes two first mounting arms (1011) and two second mounting arms (1012) disposed above the first mounting arms. The first mounting arms are configured for being attached to the printed circuit board. The resilient clips are configured for being sandwiched between the second mounting arms of the mounting frame and the heat sink. The resilient clips each include two resilient arms (1023) configured for providing a resilient force which urges the heat sink toward the heat generating electronic component. ## Claims ### Claim 1 An electronic apparatus comprising: a printed circuit board with a heat generating electronic component disposed thereon; a heat sink; and a mounting device for mounting the heat sink onto the heat generating electronic component, the mounting device comprising a mounting frame and at least two resilient clips attached to the mounting frame, the mounting frame comprising two first mounting arms and two second mounting arms disposed above the first mounting arms, the first mounting arms being attached to the printed circuit board, the at least two resilient clips being sandwiched between the second mounting arms of the mounting frame and the heat sink, the at least two resilient clips each comprising at least a resilient arm for providing a resilient force which urges the heat sink toward the heat generating electronic component. ### Claim 2 (depends on 1) The electronic apparatus of claim 1, wherein the mounting frame further comprises four connecting arms connected between the first mounting arms and the second mounting arms, the connecting arms extending upwardly from the first mounting arms and connecting free ends of the first mounting arms with free ends of the second mounting arms. ### Claim 3 (depends on 1) The electronic apparatus of claim 1, wherein a flange extends from each of the second mounting arms of the mounting frame toward an inner space of the mounting frame, the at least two resilient clips being attached to the flanges of the second mounting arms of the mounting frame. ### Claim 4 (depends on 1) The electronic apparatus of claim 1, wherein the at least two resilient clips each comprises a fastening plate, the at least a resilient arm being integrally disposed below the fastening plate, the fastening plate being attached to a corresponding one of the second mounting arms of the mounting frame, the at least a resilient arm extending downwardly from the fastening plate. ### Claim 5 (depends on 1) The electronic apparatus of claim 1, wherein the at least two resilient clips each comprises a fastening plate attached to a corresponding one of the second mounting arms of the mounting frame, the at least a resilient arm comprising a first bending portion, a first slantwise extension portion, a second bending portion, a second slantwise extension portion and a third bending portion, the first bending portion being disposed between the fastening plate and the first slantwise extension portion, the second bending portion being disposed between the first slantwise extension portion and the second slantwise extension portion, the third bending portion being formed at a free end of the second slantwise extension portion. ### Claim 6 (depends on 1) The electronic apparatus of claim 1, wherein the at least two resilient clips each comprises a fastening plate attached to a corresponding one of the second mounting arms of the mounting frame, the at least a resilient arm comprising a first bending portion, a first slantwise extension portion, a second bending portion and a second slantwise extension portion, the first bending portion connecting being disposed between the fastening plate and the first slantwise extension, the second bending portion connecting the first slantwise extension with the second slantwise extension portion, an arc surface being formed at a free end of the second slantwise extension portion. ### Claim 7 (depends on 1) The electronic apparatus of claim 1, wherein the heat sink comprises a base and a fin assembly disposed on the base, and the fin assembly defines at least two cutouts for receiving the at least two resilient clips therein. ### Claim 8 A mounting device configured for mounting a heat sink to a printed circuit board on which a heat generating electronic component is disposed, the mounting device comprising: a mounting frame comprising two first mounting arms configured for being attached to the printed circuit board, and two second mounting arms disposed above the first mounting arms; and at least two resilient clips configured for being sandwiched between the second mounting arms of the mounting frame and the heat sink, the at least two resilient clips each comprising at least a resilient arm configured for providing a resilient force which urges the heat sink toward the heat generating electronic component. ### Claim 9 (depends on 8) The mounting device of claim 8, wherein the mounting frame further comprising four connecting arms connected between the first mounting arms and the second mounting arms, the four connecting arms extending upwardly from the first mounting arms and connecting free ends of the first mounting arms with free ends of the second mounting arms. ### Claim 10 (depends on 8) The mounting device of claim 8, wherein the at least two resilient clips each comprises a fastening plate, the at least a resilient arm being integrally disposed below the fastening plate, the fastening plate being attached to a corresponding one of the second mounting arms of the mounting frame, the at least a resilient arm extending downwardly from the fastening plate. ### Claim 11 (depends on 10) The mounting device of claim 10, wherein a flange extends from each of the second mounting arms of the mounting frame toward an inner space of the mounting frame, the at least two resilient clips each being attached to a corresponding one of the flanges of the second mounting arms of the mounting frame. ### Claim 12 (depends on 8) The mounting device of claim 8, wherein the at least two resilient clips each comprise a fastening plate, the at least a resilient arm being disposed below the fastening plate, the at least a resilient arm comprising a first bending portion, a first slantwise extension portion, a second bending portion and a second slantwise extension portion, the first bending portion being disposed between the fastening plate and the first slantwise extension portion, the second bending portion being disposed between the first slantwise extension portion and the second slantwise extension portion. ### Claim 13 (depends on 12) The mounting device of claim 12, wherein the at least a resilient arm further comprises a third bending portion formed at a free end of the second slantwise extension portion. ### Claim 14 (depends on 13) The mounting device of claim 13, wherein the first bending portion, the second bending portion and the third bending portion are C-shaped in profile. ### Claim 15 (depends on 12) The mounting device of claim 12, wherein the at least a resilient arm comprises an arc surface formed at a free end of the second slantwise extension portion.