# US 7,612,987 B2 · Chip-type filter > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 7,612,987 B2 - Document ID: US7612987B2 - Status: Granted - Kind: B2 - Application number: 12/368,569 - Filed: 2009-02-10 - Published: 2009-06-18 - Granted: 2009-11-03 - Earliest claimed: 2009-02-10 - Assignees: Panasonic Corporation - Inventors: Junichi Kurita; Kenji Kuranuki; Youichi Aoshima; Hiroshi Higashitani; Tsuyoshi Yoshino - Web page: https://patentgrep.com/patent/US7612987B2 ## CPC - H01G 9/012: specially adapted for solid capacitors - H01G 9/14: Structural combinations {or circuits} for modifying, or compensating for, electric characteristics of electrolytic capacitors - H01G 9/28: Structural combinations of electrolytic capacitors, rectifiers, detectors, switching devices with other electric components not covered by this subclass - H03H 1/0007: {of radio frequency interference filters} - H01F 17/0006: {Printed inductances (printed coils for dynamo-electric machines H02K3/26; printed circuits H05K)} - H01F 27/40: Structural association with built-in electric component, e.g. fuse - H03H 2001/0085: {Multilayer, e.g. LTCC, HTCC, green sheets} - H01G: CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE (selection of specified materials as dielectric H01B3/00; capacitors having potential barriers H10D1/62, H10K10/10) - H03H: IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS (waveguides, resonators, lines or other devices of the waveguide type H01P) - H01F: MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES ## Abstract A chip-type filter has a laminated body formed by stacking a plurality of capacitor elements, a pair of positive electrode terminals, a pair of negative electrode terminals, insulating outer resin, and an inductor section. The laminated body includes capacitor elements in a first group and capacitor elements in a second group, the positive electrode sections in both groups are disposed on the opposite sides with respect to the negative electrode sections. Positive electrode terminals are electrically connected to the positive electrode sections of capacitor elements in the first group and those of capacitor elements in the second group, respectively. Negative electrode terminals are electrically connected to the negative electrode sections in the laminated body, and are disposed at both ends of the direction crossing the connecting direction between the positive electrode terminals. The inductor section is insulated from the negative electrode sections and couples the positive electrode terminals. ## Claims ### Claim 1 A chip-type filter comprising: a laminated body including: a first group formed of at least one plate-shaped capacitor element having a positive electrode section and a negative electrode section; and a second group formed by stacking at least one plate-shaped capacitor element having a positive electrode section and a negative electrode section, wherein the negative electrode section of the capacitor element in the first group and the negative electrode section of the capacitor element in the second group are stacked, and the positive electrode section of the capacitor element in the first group is disposed on the opposite side to the positive electrode section of the capacitor element in the second group with respect to the negative electrode section; a pair of positive electrode terminals electrically coupled to the positive electrode section of the capacitor element in the first group and the positive electrode section of the capacitor element in the second group, respectively; a pair of negative electrode terminals electrically coupled to the negative electrode sections of the capacitor elements in the first group and the second group, the negative electrode terminals being disposed at both ends in a direction crossing a coupling direction between the pair of positive electrode terminals, respectively; an insulating outer resin covering the laminated body in a state where parts of the positive electrode terminals and parts of the negative electrode terminals are exposed; and an inductor section insulated from the negative electrode sections of the capacitor elements in the first group and the second group, the inductor section coupling the pair of positive electrode terminals. ### Claim 2 (depends on 1) The chip-type filter according to claim 1, wherein respective capacitor elements in the first group and respective capacitor elements in the second group are stacked alternately. ### Claim 3 (depends on 1) The chip-type filter according to claim 1, wherein the capacitor elements in the first group and the capacitor elements in the second group are same in number. ### Claim 4 (depends on 1) The chip-type filter according to claim 1, wherein the respective capacitor elements in the first group are directly stacked to form an element unit, and the respective capacitor elements in the second group are directly stacked to form another element unit, and the element unit of the capacitor elements in the first group and the element unit of the capacitor elements in the second group are stacked to form the laminated body. ### Claim 5 (depends on 4) The chip-type filter according to claim 4, further comprising a positive electrode lead frames each bundling the positive electrode sections in each of the element units. ### Claim 6 (depends on 1) The chip-type filter according to claim 1, wherein a part of the inductor section is exposed on a mounting surface of the chip-type filter. ### Claim 7 (depends on 1) The chip-type filter according to claim 1, wherein a current path of the inductor section is longer than distance between the pair of positive electrode terminals. ### Claim 8 (depends on 1) The chip-type filter according to claim 1, wherein the pair of negative electrode terminals are integrally formed through a coupling section disposed between the inductor section and the negative electrode sections. ### Claim 9 (depends on 1) The chip-type filter according to claim 1, further comprising a negative electrode lead frame joined to the negative electrode sections positioned in a center of the laminated body and joined to the pair of negative electrode terminals. ### Claim 10 (depends on 9) The chip-type filter according to claim 9, wherein guide walls are disposed at both ends of the negative electrode lead frame in the direction crossing the coupling direction between the pair of positive electrode terminals, the guide walls being electrically coupled to the negative electrode sections. ### Claim 11 (depends on 1) The chip-type filter according to claim 1, wherein the pair of negative electrode terminals are directly joined to the negative electrode sections. ### Claim 12 (depends on 1) The chip-type filter according to claim 1, further comprising a pair of positive electrode lead frames joined to the positive electrode sections so as to couple the positive electrode sections positioned at both ends of the laminated body, the positive electrode lead frames being coupled to the pair of terminal sections of the positive electrode terminals, respectively. ### Claim 13 (depends on 1) The chip-type filter according to claim 1, wherein parts of the positive electrode terminals and parts of the negative electrode terminals are extended so as to project from the outer resin in the view from a top surface, and are folded upward along a side surface of the outer resin. ### Claim 14 (depends on 1) The chip-type filter according to claim 1, wherein each of the capacitor elements has: a positive electrode body made of valve action metal; and an insulating section disposed on the positive electrode body, the insulating section dividing the positive electrode body into the positive electrode section and a negative electrode-forming section, and the negative electrode section includes: the negative electrode-forming section; a dielectric oxide layer formed on the negative electrode-forming section; a solid electrolyte layer formed on the dielectric oxide layer and made of a conductive polymer; and a negative electrode layer formed on the solid electrolyte layer and made of carbon and silver paste.