# US 7,612,728 B2 · Microwave antenna for flip-chip semiconductor modules

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- Number: US 7,612,728 B2
- Document ID: US7612728B2
- Status: Granted
- Kind: B2
- Application number: 10/593,337
- Filed: 2005-03-16
- Published: 2008-10-02
- Granted: 2009-11-03
- Earliest claimed: 2004-03-19
- Assignees: Forschungsverbund Berlin E.V.
- Inventors: Wolfgang Heinrich; Prodyut Talukder
- Web page: https://patentgrep.com/patent/US7612728B2

## CPC

- H01Q 13/18: the slot being backed by, or formed in boundary wall of, a resonant cavity (longitudinally slotted cylinder H01Q13/12 ){; Open cavity antennas}
- H01Q 1/2283: {mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package}
- H01Q 1/38: formed by a conductive layer on an insulating support {(patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface H01Q15/142)}
- H01Q 13/02: Waveguide horns
- H01Q 13/0283: {Apparatus or processes specially provided for manufacturing horns}
- H01Q 19/32: the primary active element being end-fed and elongated
- H01Q 21/0093: {Monolithic arrays}
- H01Q 23/00: Antennas with active circuits or circuit elements integrated within them or attached to them
- H01Q: ANTENNAS, i.e. RADIO AERIALS (radiators or antennas for microwave heating H05B6/72)

## Abstract

The invention relates to a microwave antenna for flip-chip semiconductor modules, comprising two semiconductor substrates which are metallized on the surface thereof. Patch antennas, i.e. metallized flat areas which are insulated from the rest of the circuit on an outer surface of a module with a supply line to the circuit, are already known per se. They result in vertical radiation at a relatively large angle. According to the invention, a closed group of bumps are arranged in such a way that the distance of the bumps (2) to each other is less than the half wavelength (λ/2) of the microsignal which is to be radiated or received and an open radiation slot arises in at least one pair of side walls (3,4) of the semiconductor substrates (a,b) and a bump, which is connected to the circuit of the semiconductor module, is arranged between the bumps (2) and the radiation slot, enabling the microwave antenna to be excited.

## Claims

### Claim 1

A microwave antenna for flip-chip semiconductor modules, comprising:
two semiconductor substrates, which are metallized on a surface thereof, wherein a closed group of bumps are arranged between the semiconductor substrates in such a way that the distance between the bumps in the closed group of bumps is less than half of the wavelength of a microwave signal which is to be radiated or received;
an open radiation slot in at least one pair of side walls of the semiconductor substrates; and
a bump, connected to a circuit of a semiconductor module, arranged between the closed group of bumps and the radiation slot, enabling the microwave antenna to be excited.

### Claim 2 (depends on 1)

The microwave antenna of claim 1, wherein the closed group of bumps and the radiation slot are positioned in a triangular shape.

### Claim 3 (depends on 1)

The microwave antenna of claim 1, wherein the length of the radiation slot is approximately half of the wavelength of the microwave signal.

### Claim 4 (depends on 1)

The microwave antenna of claim 1, wherein the height of the closed group of bumps is considerably less than half of the wavelength of the microwave signal.

### Claim 5 (depends on 1)

The microwave antenna of claim 1, wherein the height of the semiconductor module is higher by one tenth of the of the microwave signal.

### Claim 6 (depends on 1)

The microwave antenna of claim 1, wherein the side walls of the semiconductor substrates in the area of the radiation slot are at least in part provided with metallization.

### Claim 7 (depends on 6)

The microwave antenna of claim 6, wherein the metallization of the side walls of the semiconductor substrates is implemented by means of via chains.

### Claim 8 (depends on 1)

The microwave antenna of claim 1, wherein the bump, which is connected to the circuit of the semiconductor module, is positioned in such a manner that the microwave antenna will have impedance matched to the resonance frequency of the microwave antenna.

### Claim 9 (depends on 1)

The microwave antenna of claim 1, wherein at least on one of the semiconductor substrates a monolithically integrated circuit is arranged in the area of the antenna range opened up by the bumps and the radiation slot.

### Claim 10 (depends on 1)

The microwave antenna of claim 1, wherein bumps in the closed group of bumps set between the semiconductor substrates are arranged in the shape of a cross, so that a four-sector antenna is created.