# US 7,612,638 B2 · Waveguides in integrated circuits > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 7,612,638 B2 - Document ID: US7612638B2 - Status: Granted - Kind: B2 - Application number: 11/486,903 - Filed: 2006-07-14 - Published: 2008-01-17 - Granted: 2009-11-03 - Earliest claimed: 2006-07-14 - Assignees: Taiwan Semiconductor Manufacturing Company, Ltd. - Inventors: Shine Chung; Fu-Lung Hsueh - Web page: https://patentgrep.com/patent/US7612638B2 ## CPC - H01P 3/12: Hollow waveguides (H01P3/20 takes precedence) - H01P: WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE (operating at optical frequencies G02B) ## Abstract A waveguide in semiconductor integrated circuit is disclosed, the waveguide comprises a horizontal first metal plate, a horizontal second metal plate above the first metal plate, separated by an insulation material, and a plurality of metal vias positioned in two parallel lines, running vertically through the insulation material in contacts with both the first and second metal plates, wherein the first and second metal plates and the plurality of metal vias form a metal enclosure in a cross-sectional view that can serve as a waveguide. ## Claims ### Claim 1 A waveguide in semiconductor integrated circuits, the waveguide comprising: a horizontal first metal plate; a horizontal second metal plate above the first metal plate, separated by a first insulation material; and a first plurality of separate metal vias aligned to form two parallel planes, running vertically through the insulation material in contact with both the first and second metal plates, wherein the first and second metal plates and the two parallel planes formed by the vias further form a first metal enclosure in a cross-sectional view, wherein a minimum via spacing between two adjacent metal vias in the same plane is less than about one tenth of a wavelength of an electromagnetic radiation transmitting through the first metal enclosure, and wherein the horizontal first metal plate or the horizontal second metal plate has one or more openings with a diameter less than the minimum via spacing between two adjacent metal vias in the same plane. ### Claim 2 (depends on 1) The waveguide of claim 1 further comprises a semiconductor substrate below the first metal plate, wherein a plurality of semiconductor devices can be built upon. ### Claim 3 (depends on 1) The waveguide of claim 1, wherein the first metal plate is made of copper, copper alloy, aluminum or aluminum alloy. ### Claim 4 (depends on 1) The waveguide of claim 1, wherein the second metal plate is made of copper, copper alloy, aluminum or aluminum alloy. ### Claim 5 (depends on 1) The waveguide of claim 1, wherein the first plurality of separate metal vias is made of copper, copper alloy, aluminum, aluminum alloy or tungsten. ### Claim 6 (depends on 1) The waveguide of claim 1, wherein the two parallel planes further comprises: one or more via stacks comprising a second plurality of separate metal vias running vertically through the insulation material, stacked on top of and located approximately in line with the first plurality of separate metal vias; and one or more metal strips situated between and in contact with both the first and second pluralities of separate metal vias, wherein the two parallel planes is formed by the via stacks on top of the first plurality of separate metal vias and the metal strips. ### Claim 7 (depends on 1) The waveguide of claim 1 further comprising a first electrical conductive line circumferenced by the first insulation material inside the first metal enclosure, running parallel to the first and second metal plates, wherein the electrical conductive line forms a core conductor, and the first metal enclosure forms an outer conductive layer of a coaxial line. ### Claim 8 (depends on 1) The waveguide of claim 1 further comprising: a horizontal third metal plate above the second metal plate, separated from the second metal plate by a second insulation material; and a third plurality of separate metal vias positioned in two parallel planes, running vertically through the second insulation material in contacts with both the second and third metal plates, wherein the second and third metal plates and the third plurality of separate metal vias form a second metal enclosure in a cross-sectional view. ### Claim 9 (depends on 8) The waveguide of claim 8, wherein the third metal plate is made of copper, copper alloy, aluminum or aluminum alloy. ### Claim 10 (depends on 8) The waveguide of claim 8, wherein the third metal plate has one or more openings. ### Claim 11 (depends on 8) The waveguide of claim 8 further comprising a second electrical conductive line circumferenced by the second insulation material inside the second metal enclosure, running parallel to the second and third metal plates, wherein the second electrical conductive line forms a second core conductor, and the second metal enclosure forms an outer conductive layer of a second coaxial line. ### Claim 12 A waveguide in semiconductor integrated circuits, the waveguide comprising: a semiconductor substrate for forming a plurality of semiconductor devices; a horizontal first metal plate above the semiconductor substrate, separated from the plurality of semiconductor devices by a first insulation material; a horizontal second metal plate above the first metal plate, separated by a second insulation material; and a first plurality of separate metal vias aligned to form two parallel planes, running vertically through the second insulation material in contact with both the first and second metal plates, wherein the first and second metal plates and the two parallel planes formed by the vias further form a first metal enclosure in a cross-sectional view, wherein a minimum via spacing between two adjacent metal vias in the same plane is less than about one tenth of a wavelength of an electromagnetic radiation transmitting through the first metal enclosure, and wherein the first metal plate or the second metal plate has one or more openings with a diameter less than the minimum via spacing between two adjacent metal vias in the same plane. ### Claim 13 (depends on 12) The waveguide of claim 12, wherein the first metal plate is made of copper, copper alloy, aluminum or aluminum alloy. ### Claim 14 (depends on 12) The waveguide of claim 12, wherein the second metal plate is made of copper, copper alloy, aluminum or aluminum alloy. ### Claim 15 (depends on 12) The waveguide of claim 12, wherein the first plurality of vias is made of copper, copper allay, aluminum, aluminum alloy or tungsten. ### Claim 16 (depends on 12) The waveguide of claim 12, wherein the two parallel planes further comprises: one or more via stacks comprising a second plurality of separate metal vias running vertically through the insulation material, stacked on top of and located approximately in line with the first plurality of separate metal vias; and one or more metal strips situated between and in contact with both the first and second pluralities of separate metal vias, wherein the two parallel planes is formed by the via stacks on top of the first plurality of separate metal vias and the metal strips. ### Claim 17 (depends on 12) The waveguide of claim 12 further comprising a first electrical conductive line circumferenced by the first insulation material inside the first metal enclosure, running parallel to the first and second metal plates, wherein the electrical conductive line forms a core conductor, and the first metal enclosure forms an outer conductive layer of a coaxial line. ### Claim 18 (depends on 12) The waveguide of claim 12 further comprising: a horizontal third metal plate above the second metal plate, separated from the second metal plate by a third insulation material; and a third plurality of separate metal vias positioned in two parallel planes, running vertically through the second insulation material in contacts with both the second and third metal plates, wherein the second and third metal plates and the third plurality of metal vias form a second metal enclosure in a cross-sectional view. ### Claim 19 (depends on 18) The waveguide of claim 18 further comprising a second electrical conductive line circumferenced by the third insulation material inside the second metal enclosure, running parallel to the second and third metal plates, wherein the second electrical conductive line forms a second core conductor, and the second metal enclosure forms an outer conductive layer of a second coaxial line.