# US 7,612,631 B2 · Motherboard > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 7,612,631 B2 - Document ID: US7612631B2 - Status: Granted - Kind: B2 - Application number: 11/942,727 - Filed: 2007-11-20 - Published: 2009-04-16 - Granted: 2009-11-03 - Earliest claimed: 2007-10-11 - Assignees: Hon Hai Precision Industry Co., Ltd. - Inventors: Shou-Kuo Hsu; Chien-Hung Liu; Cheng-Shien Li - Web page: https://patentgrep.com/patent/US7612631B2 ## CPC - G06F 13/409: {Mechanical coupling (back panels H05K7/1438)} - G06F: ELECTRIC DIGITAL DATA PROCESSING (computer systems based on specific computational models G06N) ## Abstract A motherboard includes a signal control chip, a signal switch chip connected to the signal control chip via a plurality of first transmission lines, and a complex connector configured for connecting to a first type of transmission device or a second type of transmission device. The signal control chip is connected to the complex connector via the first transmission lines and a plurality of second transmission lines. The signal switch chip is electrically connected to the complex connector via a plurality of third transmission lines. Each second transmission line is connected in series with a first resistor. Each third transmission line is connected in series with a second resistor. When the first type of transmission device is mounted on the complex connector, the signal switch chip and the second resistors are removed. When the second type of transmission device is mounted on the complex connector, the first resistors are removed. ## Claims ### Claim 1 A motherboard, comprising: a signal control chip; a signal switch chip electrically connected to the signal control chip via a plurality of first transmission lines; and a complex connector configured for connecting to a first type of transmission device or a second type of transmission device, the signal control chip electrically connected to the complex connector via the plurality of first transmission lines and a plurality of second transmission lines, the signal switch chip electrically connected to the complex connector via a plurality of third transmission lines, each of the second transmission lines connected in series with a first resistor, each of the third transmission lines connected in series with a second resistor; wherein when the first type of transmission device is mounted on the complex connector, the signal switch chip and the second resistors are removed from the motherboard, when the second type of transmission device is mounted on the complex connector, the first resistors are removed from the motherboard instead. ### Claim 2 (depends on 1) The motherboard as claimed in claim 1, wherein when the first or second resistors are removed from the motherboard remaining stubs of the transmission lines must satisfy the following formula: Lstub<(Tj*V)/2, Tj denotes a jitter tolerance of a signal in the transmission line, V denotes the speed of the signal. ### Claim 3 (depends on 1) The motherboard as claimed in claim 1, wherein the first and second resistors are zero Ohm resistors. ### Claim 4 (depends on 1) The motherboard as claimed in claim 1, wherein each of the first transmission lines is connected in series with a first capacitor. ### Claim 5 (depends on 1) The motherboard as claimed in claim 1, wherein each of the third transmission lines is connected in series with a second capacitor. ### Claim 6 (depends on 1) The motherboard as claimed in claim 1, wherein the first transmission device is a SAS HDD, the second transmission device is a SATA HDD, the complex connector is a SAS/SATA complex connector, the signal switch chip is a SAS-SATA signal switch chip. ### Claim 7 A motherboard, comprising: a signal control chip pad configured for mounting a signal control chip; a signal switch chip pad configured for mounting a signal switch chip and electrically connected to the signal control chip pad via a plurality of first transmission lines; and a complex connector pad configured for mounting a complex connector which can connect with a first type of transmission device or a second type of transmission device, the signal control chip pad electrically connected to the complex connector via the plurality of first transmission lines and a plurality of second transmission lines, the signal switch chip pad electrically connected to the complex connector pad via a plurality of third transmission lines, each of the second transmission lines connected in series with a first resistor pad configured for mounting a first resistor, each of the third transmission lines connected in series with a second resistor pad configured for mounting a second resistor. ### Claim 8 (depends on 7) The motherboard as claimed in claim 7, wherein the length between the first resistor pads and the complex connector pads must satisfy the following formula: Lstub<(Tj*V)/2, Lstub denotes the length between the first resistor pads and the complex connector pads, Tj denotes a jitter tolerance of a signal in the transmission line, V denotes the speed of the signal. ### Claim 9 (depends on 7) The motherboard as claimed in claim 7, wherein the length between the second resistor pads and the complex connector pads must satisfy the following formula: Lstub<(Tj*V)/2, Lstub denotes the length between the second resistor pads and the complex connector pads, Tj denotes a jitter tolerance of a signal in the transmission line, V denotes the speed of the signal. ### Claim 10 (depends on 7) The motherboard as claimed in claim 7, wherein each of the first transmission lines is connected in series with a first capacitor pad configured for mounting a first capacitor. ### Claim 11 (depends on 7) The motherboard as claimed in claim 7, wherein each of the third transmission lines is connected in series with a second capacitor pad configured for mounting a second capacitor.