# US 7,612,571 B2 · System and method for estimation of integrated circuit signal characteristics using optical measurements > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 7,612,571 B2 - Document ID: US7612571B2 - Status: Granted - Kind: B2 - Application number: 12/115,658 - Filed: 2008-05-06 - Published: 2008-08-28 - Granted: 2009-11-03 - Earliest claimed: 2005-02-02 - Assignees: International Business Machines Corporation - Inventors: Franco Stellari; Alberto Tosi; Peilin Song - Web page: https://patentgrep.com/patent/US7612571B2 ## CPC - G01R 31/311: of integrated circuits {(G01R31/31728 takes precedence)} - Y10T 29/49004: including measuring or testing of device or component part - G01R: MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES (indicating correct tuning of resonant circuits H03J3/12) - Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION ## Abstract Systems and methods for making electrical measurements using optical emissions include positioning a sensor/photodetector to measure radiation emissions from devices to be tested. Radiation emission information is collected from the device to be tested during electrical operation. Characteristic features of the radiation emission information are determined, and differences between the characteristic features are deciphered. Based on the differences, models are employed to determine electrical properties of the device, especially operational characteristics. ## Claims ### Claim 1 A system for making electrical measurements using optical emissions, comprising: a position module, which determines the positions of devices to be tested on an integrated circuit; a radiation sensor/photodetector positionable in accordance with the position module: the radiation sensor/photodetector collects radiation emission information from the devices to be tested during electrical operation; an analysis module, which determines characteristic features of the radiation emission information between at least two devices and makes a measurement based upon separation distances between the characteristic features of the radiation emission information wherein the separation distance is compared with a model to determine the measurement. ### Claim 2 (depends on 1) The system as recited in claim 1, wherein the position module positions the radiation sensor/photodetector in accordance with a digital layout of the integrated circuit. ### Claim 3 (depends on 1) The system as recited in claim 1, wherein the sensor includes an optical sensor/photodetector and die radiation includes infrared or near-infrared radiation. ### Claim 4 (depends on 1) The system as recited in claim 1, wherein the model comprises an analytical model, which provides reference information to the analysis module to determine measurement quantities based on the radiation emission information. ### Claim 5 (depends on 4) The system as recited in claim 4, wherein the analytical model includes a characteristic curve for matching collected data to measurements. ### Claim 6 (depends on 1) The system as recited in claim 1, wherein the model includes a simulation, which provides reference information to the analysis module to determine measurement quantities based on the radiation emission information. ### Claim 7 (depends on 1) The system as recited in claim 1, wherein the sensor includes a mechanism for excluding light from sources other than the device to be tested. ### Claim 8 (depends on 1) The system as recited in claim 1, wherein the characteristic features include peaks of the radiation emissions. ### Claim 9 (depends on 8) The system as recited in claim 8, wherein the separation distances between the characteristic features include time separation between the peaks. ### Claim 10 (depends on 1) The system as recited in claim 1, wherein the analysis module measures slew rate. ### Claim 11 (depends on 1) The system as recited in claim 1, wherein the analysis module measures switching time. ### Claim 12 (depends on 1) The method as recited in claim 1, wherein the analysis module determines characteristic features of the radiation emission information between an n-FET and a p-FET. ### Claim 13 A method for making electrical measurements using optical emissions, comprising: positioning a sensor/photodetector to measure radiation emissions from a device; performing electrical operations on the device; collecting radiation emission information from the device during the electrical operations including peaks in the radiation emission information; measuring a separation between the peaks of different devices; and comparing the separation to a model to determine an electrical property. ### Claim 14 (depends on 13) The method as recited in claim 13, further comprising the step of selecting a device on an integrated circuit to be tested. ### Claim 15 (depends on 13) The method as recited in claim 13, further comprising the step of adjusting the sensor to limit light from other sources other than light from the device to be tested. ### Claim 16 (depends on 13) The method as recited in claim 13, wherein the electrical property includes slew rate. ### Claim 17 (depends on 13) The method as recited in claim 13, wherein the model includes a characteristic curve. ### Claim 18 (depends on 13) The method as recited in claim 13, wherein the electrical property includes switching time. ### Claim 19 (depends on 13) A program storage device readable by machine, tangibly embodying a program of instructions executable by the machine to perform method steps for making electrical measurements using optical emissions as recited in claim 13. ### Claim 20 (depends on 13) The method as recited in claim 13, wherein each device is either an n-FET or a p-FET.