# US 7,612,448 B2 · Power module having a cooling device and semiconductor devices mounted on a resin substrate, method of producing same, and air conditioner > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 7,612,448 B2 - Document ID: US7612448B2 - Status: Granted - Kind: B2 - Application number: 11/791,844 - Filed: 2005-12-01 - Published: 2008-05-15 - Granted: 2009-11-03 - Earliest claimed: 2004-12-13 - Assignees: Daikin Industries, Ltd. - Inventors: Junichi Teraki; Mitsuhiro Tanaka - Web page: https://patentgrep.com/patent/US7612448B2 ## CPC - H10W 90/00: Package configurations - H05K 1/021: {Components thermally connected to metal substrates or heat-sinks by insert mounting} - H05K 7/20927: {Liquid coolant without phase change} - H10W 40/47: by flowing liquids, e.g. forced water cooling - H05K 1/0206: {by printed thermal vias} - H05K 1/0272: {Adaptations for fluid transport, e.g. channels, holes} - H05K 1/0298: {Multilayer circuits} - H05K 1/183: associated with components mounted in and supported by recessed areas of the PCBs - H05K 3/0061: {onto a metallic substrate, e.g. a heat sink (heat sinks for electric apparatus H05K7/20)} - H05K 2201/064: Fluid cooling, e.g. by integral pipes - H10W 40/228: {the projecting parts being wire-shaped or pin-shaped} - H10W 74/00: Encapsulations, e.g. protective coatings - H10W 90/754: {between a chip and a stacked insulating package substrate, interposer or RDL} - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ## Abstract A power module includes a power semiconductor, a non-power semiconductor, one resin substrate, and a cooling device. The power semiconductor and the non-power semiconductor configure a power supply circuit for performing power conversion. Both the power semiconductor and the non-power semiconductor are mounted on the resin substrate. The cooling device is disposed in order to cool the power semiconductor. ## Claims ### Claim 1 A power module comprising: a power semiconductor device and a non-power semiconductor device configuring a power supply circuit to perform power conversion; a resin substrate, both the power semiconductor device and the non-power semiconductor device being mounted on the resin substrate; and a cooling device being configured to cool the power semiconductor device, the cooling device including a cooling fluid passage disposed on a side opposite a mounting surface of the resin substrate, the power semiconductor device and the non-power semiconductor device being mounted on the mounting surface of the resin substrate, the cooling fluid passage allowing a cooling fluid to cool the power semiconductor device to pass therethrough, a shortest distance between the power semiconductor device and the cooling fluid passage being shorter than a shortest distance between the non-power semiconductor device and the cooling fluid passage. ### Claim 2 (depends on 1) The power module of claim 1, wherein the cooling fluid passage is disposed inside the resin substrate. ### Claim 3 (depends on 1) The power module of claim 1, further comprising a temperature detector that detects the temperature of the power semiconductor device or the vicinity thereof, and a temperature controller that controls the temperature of the cooling fluid such that the temperature detected by the temperature detector becomes a predetermined temperature. ### Claim 4 A power module comprising: a power semiconductor device and a non-power semiconductor device configuring a power supply circuit to perform power conversion; a resin substrate, both the power semiconductor device and the non-power semiconductor device being mounted on the resin substrate, a thickness of a portion of the resin substrate on which the power semiconductor device is mounted being thinner than a thickness of a portion of the resin substrate on which the non-power semiconductor device is mounted; and a cooling device being configured to cool the power semiconductor device. ### Claim 5 (depends on 1) The power module of claim 1, wherein the resin substrate is configured by a plurality of laminate units laminated in a board thickness direction, and a thickness of a portion on which the power semiconductor device is mounted and a thickness of a portion on which the non-power semiconductor device is mounted are adjusted depending on shapes of the laminate units. ### Claim 6 (depends on 1) The power module of any of claim 1, further comprising a heat diffusing portion that diffuses heat arising from at least the power semiconductor device. ### Claim 7 (depends on 6) The power module of claim 6, further comprising an electrical insulation layer disposed between the heat diffusing portion and the cooling fluid passage. ### Claim 8 (depends on 6) The power module of claim 6, wherein a heat spreader disposed between the power semiconductor device and the mounting surface of the resin substrate is included in the heat diffusing portion. ### Claim 9 (depends on 6) The power module of claim 6, wherein a thermal through hole disposed inside the resin substrate along a direction intersecting a board surface of the resin substrate is included in the heat diffusing portion. ### Claim 10 (depends on 6) The power module of claim 6, wherein a thermally conductive filler dispersed and mixed in with a resin portion of the resin substrate is included in the heat diffusing portion. ### Claim 11 (depends on 3) The power module of claim 3, wherein a thermally conductive sheet embedded in a resin portion of the resin substrate is included in the heat diffusing portion. ### Claim 12 A power module comprising: a power semiconductor device and a non-power semiconductor device configuring a power supply circuit to perform power conversion; a mounting substrate, both the power semiconductor device and the non-power semiconductor device being mounted on the mounting substrate, the mounting substrate having a thermal conductivity in a board thickness direction that is 10 W/(m·K) or less; and a cooling device being configured to cool the power semiconductor device, the cooling device including a cooling fluid passage disposed on a side opposite a mounting surface of the mounting substrate, the power semiconductor device and the non-power semiconductor device being mounted on the mounting surface of the mounting substrate, the cooling fluid passage allowing a cooling fluid to cool the power semiconductor device to pass therethrough, a shortest distance between the power semiconductor device and the cooling fluid passage being shorter than a shortest distance between the non-power semiconductor device and the cooling fluid passage. ### Claim 13 An air conditioner comprising: a refrigerant circuit; and a power module including a power semiconductor device and a non-power semiconductor device configuring a power supply circuit to perform power conversion, a resin substrate, both the power semiconductor device and the non-power semiconductor device being mounted on the resin substrate, and a refrigerant passage being disposed on a side opposite a mounting surface of the resin substrate, the power semiconductor device and the non-power semiconductor device being mounted on the mounting surface, the refrigerant passage allowing refrigerant flowing in the refrigerant circuit to pass therethrough, a shortest distance between the power semiconductor device and the refrigerant passage being shorter than a shortest distance between the non-power semiconductor device and the refrigerant passage. ### Claim 14 A method of producing a power module comprising: fixing a power semiconductor device and a non-power semiconductor device to prescribed positions on a resin substrate; connecting the power semiconductor device and a circuit disposed on the resin substrate; connecting the non-power semiconductor device and the circuit; and fixing the resin substrate to a cooling device such that a shortest distance between the power semiconductor device and a cooling fluid passage of the cooling device being shorter than a shortest distance between the non-power semiconductor device and the cooling fluid passage. ### Claim 15 (depends on 6) The power module of claim 6, wherein a thermally conductive sheet embedded in a resin portion of the resin substrate is included in the heat diffusing portion. ### Claim 16 (depends on 1) The power module of any of claim 1, further comprising a heat diffusing portion for diffusing heat arising from at least the power semiconductor device. ### Claim 17 A power module comprising: a power semiconductor device and a non-power semiconductor device configuring a power supply circuit to perform power conversion; a mounting substrate, both the power semiconductor device and the non-power semiconductor device being mounted on the mounting substrate, the mounting substrate having a thermal conductivity in a board thickness direction that is 10 W/(m·K) or less, a thickness of a portion of the mounting substrate on which the power semiconductor device is mounted being thinner than a thickness of a portion of the mounting substrate on which the non-power semiconductor device is mounted; and a cooling device being configured to cool the power semiconductor device. ### Claim 18 An air conditioner comprising: a refrigerant circuit; and a power module including a power semiconductor device and a non-power semiconductor device configuring a power supply circuit to perform power conversion, a resin substrate, both the power semiconductor device and the non-power semiconductor device being mounted on the resin substrate, a thickness of a portion of the resin substrate on which the power semiconductor device is mounted being thinner than a thickness of a portion of the resin substrate on which the non-power semiconductor device is mounted, and a refrigerant passage being disposed on a side opposite a mounting surface of the resin substrate, the power semiconductor device and the non-power semiconductor device being mounted on the mounting surface, the refrigerant passage allowing refrigerant flowing in the refrigerant circuit to pass therethrough. ### Claim 19 A method of producing a power module comprising: fixing a power semiconductor device and a non-power semiconductor device to prescribed positions on a resin substrate such that a thickness of a portion of the resin substrate on which the power semiconductor device is mounted is thinner than a thickness of a portion of the resin substrate on which the non-pow semiconductor device is mounted; connecting the power semiconductor device and a circuit disposed on the resin substrate; connecting the non-power semiconductor device and the circuit; and fixing the resin substrate to a cooling device. ### Claim 20 A power module comprising: a power semiconductor device and a non-power semiconductor device configuring a power supply circuit to perform power conversion; a resin substrate, both the power semiconductor device and the non-power semiconductor device being mounted on a mounting surface on a portion of the resin substrate; and a stepped cooling device contacting the portion of the resin substrate, and contacting only a surface on a side opposite the mounting surface of the portion of the resin substrate on which at least the power semiconductor is mounted.