# US 7,612,436 B1 · Packaged microelectronic devices with a lead frame > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 7,612,436 B1 - Document ID: US7612436B1 - Status: Granted - Kind: B1 - Application number: 12/183,981 - Filed: 2008-07-31 - Granted: 2009-11-03 - Earliest claimed: 2008-07-31 - Assignees: Micron Technology, Inc. - Inventors: Teck Kheng Lee; Voon Siong Chin; Ai-Chie Wang - Web page: https://patentgrep.com/patent/US7612436B1 ## CPC - H10W 90/811: {Multiple chips on leadframes} - H10W 70/411: {Chip-supporting parts, e.g. die pads} - H10W 70/415: {Leadframe inner leads serving as die pads} - H10W 72/5449: {not being orthogonal to a side surface of the chip, e.g. fan-out arrangements} - H10W 72/552: {comprising metals or metalloids, e.g. silver} - H10W 72/884: {Die-attach connectors and bond wires} - H10W 72/932: {Plan-view shape, i.e. in top view} - H10W 74/00: Encapsulations, e.g. protective coatings - H10W 90/00: Package configurations - H10W 90/24: at least one of the stacked chips being laterally offset from a neighbouring stacked chip, e.g. chip stacks having a staircase shape - H10W 90/732: {between stacked chips} - H10W 90/752: {between stacked chips} - Y10T 29/49121: Beam lead frame or beam lead device - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION ## Abstract Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices are disclosed herein. In one embodiment, a packaged microelectronic device can include a support member and at least one die in a stacked configuration attached to the support member. The support member may include a leadframe disposed longitudinally between first and second ends and latitudinally between first and second sides. The leadframe includes a lead extending between the first end and the first side. ## Claims ### Claim 1 A microelectronic device, comprising: a leadframe disposed longitudinally between first and second ends and disposed latitudinally between first and second sides, the leadframe including— a first lead extending between the first end and the second end; a second lead extending between the first end and the first side; and a die paddle disposed longitudinally between the first and second ends and disposed latitudinally between the first and second sides; a first die mechanically coupled to the die paddle of the leadframe, the first die having a first edge proximate the first end at the leadframe, a second edge spaced inwardly of the second end of the leadframe, integrated circuitry, and an external terminal electrically connected to the integrated circuitry; and a first wire bond electrically coupling one of the leads of the leadframe and the terminal of the first die. ### Claim 2 (depends on 1) The microelectronic device of claim 1, further comprising: an encapsulant generally encasing the first die, the first wire bond and at least a portion of the leadframe; and wherein no lead lock tape contacts the first and second leads within the encapsulant. ### Claim 3 (depends on 1) The microelectronic device of claim 1, wherein the leadframe includes a leadframe length measured longitudinally between the first and second ends, the first lead has a first length measured lengthwise along the first lead between the first and second ends, and the second lead includes a second length measured lengthwise along the second lead between the first end and the first side; and wherein the first length is approximately equal to the leadframe length, and the second length is different than the leadframe length. ### Claim 4 (depends on 3) The microelectronic device of claim 3, wherein the second lead has a longitudinal section extending lengthwise from the first end of the leadframe to a bend between the second end of the leadframe and the second edge of the first die and a lateral section extending from the bend to the first side, and wherein the first wirebond is attached to the second lead. ### Claim 5 (depends on 4) The microelectronic device of claim 4, further comprising a second die stacked on the first die, and a second wirebond attached to the second lead and the second die. ### Claim 6 A microelectronic device, comprising: a leadframe disposed longitudinally between first and second ends and disposed latitudinally between first and second sides, the leadframe including— a first lead extending generally longitudinally between the first and second ends of the leadframe; a second lead having a first section, a second section, and a second bond pad, the first section of the second lead extending generally longitudinally from the first end, and the second section of the second lead extending generally laterally between the first side and the first section of the second lead; a third lead having a first section, a second section, and a third bond pad, the first section of the third lead extending generally longitudinally from the first end, and the second section of the third lead extending generally laterally between the second side and the first section of the third lead; and a die paddle disposed longitudinally between the first end and the second sections of the second and third leads, the die paddle being disposed latitudinally between the first and second sides; a first die mechanically coupled to the die paddle of the leadframe, the first die including a first plurality of electrical terminals; and a plurality of wire bonds electrically coupling the leadframe and the first die, the plurality of wire bonds including a first wire bond electrically coupling a first one of the first plurality of electrical terminals and the first bond pad, a second wire bond electrically coupling a second one of the first plurality of electrical terminals and the second bond pad, and a third wire bond electrically coupling a third one of the first plurality of electrical terminals and the third bond pad; and an encapsulant encasing the first die and the plurality of wire bonds, and the first sections of the second and third leads project outside the encapsulant. ### Claim 7 (depends on 6) The microelectronic device according to claim 6, wherein the second sections of the second and third leads extend generally perpendicular to the first sections of the second and third leads, respectively, and also generally perpendicular the sides of the leadframe. ### Claim 8 (depends on 6) The microelectronic device of claim 6, further comprising: a second die mechanically coupled to the first die, the second die including a second plurality of electrical terminals; wherein the plurality of wire bonds includes a fourth wire bond electrically coupling a first one of the second plurality of electrical terminals and the fourth bond pad, and a fifth wire bond electrically coupling a second one of the second plurality of electrical terminals and the fifth bond pad. ### Claim 9 (depends on 8) The microelectronic device of claim 8, wherein the second die is disposed in a staggered-step configuration with respect to the first die. ### Claim 10 (depends on 6) The microelectronic device of claim 6, wherein the first die includes a NAND flash memory. ### Claim 11 A microelectronic device, comprising: a plurality of memory dies, wherein individual dies have a first end, a second end, and a terminal array proximate the second end, and wherein the dies are stacked in a staggered-step configuration such that an upper die reveals the terminal array of an immediately adjacent underlying die; a leadframe extending longitudinally between first and second ends and extending latitudinally between first and second sides, the leadframe including— a die paddle disposed longitudinally between the first and second ends and latitudinally between the first and second sides, the plurality of memory dies being stacked on the die paddle such that the sets of electric terminals are proximate but spaced apart from the second end of the leadframe; and a first lead including first and second sections and a bond pad, the first section extending from the first end of the leadframe, the second section extending from the first side of the leadframe, and the bond pad being disposed between the plurality of memory dies and the second end of the leadframe; and a wire bond electrically coupling one of the electric terminals and the bond pad. ### Claim 12 (depends on 11) The microelectronic device of claim 11, wherein the die paddle of the leadframe is downset relative to a portion of the first section of the first lead proximate the first end of the leadframe and is downset relative to a portion of the second section of the first lead proximate the first side of the lead frame. ### Claim 13 (depends on 11) The microelectronic device of claim 11, wherein a bottom one of the plurality of memory dies in the stagger-step configuration is mechanically coupled to the die paddle. ### Claim 14 (depends on 11) The microelectronic device of claim 11, further comprising: an encapsulant encasing the plurality of memory dies, the die paddle of the leadframe and the wire bond, and the first section of the first lead projects outside the encapsulant.