# US 7,612,434 B2 · Electronic device having wiring substrate and lead frame > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 7,612,434 B2 - Document ID: US7612434B2 - Status: Granted - Kind: B2 - Application number: 11/976,503 - Filed: 2007-10-25 - Published: 2008-03-13 - Granted: 2009-11-03 - Earliest claimed: 2004-01-14 - Assignees: Denso Corporation - Inventors: Norihisa Imaizumi; Yuuki Sanada; Takeshi Ishikawa - Web page: https://patentgrep.com/patent/US7612434B2 ## CPC - H10W 90/00: Package configurations - H05K 1/144: {Stacked arrangements of planar printed circuit boards} - H10W 70/461: {specially adapted for cooling} - H10W 70/468: {Circuit boards} - H10W 70/479: {on or in insulating or insulated package substrates, interposers, or redistribution layers} - H10W 90/811: {Multiple chips on leadframes} - H05K 1/117: {Pads along the edge of rigid circuit boards, e.g. for pluggable connectors} - H05K 1/145: {Arrangements wherein electric components are disposed between and simultaneously connected to two planar printed circuit boards, e.g. Cordwood modules} - H05K 3/284: {for encapsulating mounted components (H05K1/185 takes precedence)} - H05K 3/3405: {Edge mounted components, e.g. terminals} - H05K 2201/09845: Stepped hole, via, edge, bump or conductor - H05K 2201/1034: Edge terminals, i.e. separate pieces of metal attached to the edge of the printed circuit board [PCB] - H05K 2201/10924: Leads formed from a punched metal foil - H10W 72/07552: {changes in structures or sizes} - H10W 72/07553: {changes in shapes} - H10W 72/527: {Multiple bond wires having different sizes} - H10W 72/5363: {the connected ends being wedge-shaped} - H10W 72/537: {Multiple bond wires having different shapes} - H10W 72/5445: {being orthogonal to a side surface of the chip, e.g. parallel arrangements} - H10W 72/5473: {multiple bond wires connected to a common bond pad} - H10W 72/884: {Die-attach connectors and bond wires} - H10W 74/00: Encapsulations, e.g. protective coatings - H10W 90/732: {between stacked chips} - H10W 90/734: {between a chip and a stacked insulating package substrate, interposer or RDL} - H10W 90/754: {between a chip and a stacked insulating package substrate, interposer or RDL} - H10W 90/756: {between a chip and a stacked lead frame, conducting package substrate or heat sink} - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ## Abstract An electronic device includes: a first substrate and a second substrate; a lead frame disposed between the first and the second substrates for electrically connecting therebetween; and a first groove and a second groove disposed on the first and the second substrates, respectively. The first and the second grooves correspond to a connection portion between the first and the second substrates and the lead frame. The lead frame is connected to the first and the second substrates in such a manner that one end of the lead frame is engaged in both of the first and the second grooves through a conductive bonding material. ## Claims ### Claim 1 An electronic device comprising: a wiring substrate; a first electric part disposed on the wiring substrate; a lead frame connected to the wiring substrate through a conductive bonding material; and a second electric part, wherein the wiring substrate includes a groove corresponding to a connection portion between the wiring substrate and the lead frame, the lead frame is connected to the substrate in such a manner that one end of the lead frame is engaged in the groove through the conductive bonding material, the lead frame has a surface, which is opposite to the connection portion, the second electric part is disposed on the surface of the lead frame, and the second electric part electrically connects to the wiring substrate. ### Claim 2 (depends on 1) The device according to claim 1, wherein the second electric part electrically connects to the wiring substrate with a bonding wire. ### Claim 3 (depends on 1) The device according to claim 1, wherein the wiring substrate includes a terminal, and the one end of the lead frame includes an extension portion extending to the terminal of the wiring substrate so that the extension portion electrically connects to the terminal. ### Claim 4 (depends on 1) The device according to claim 1, further comprising: a heat radiation plate disposed on the wiring substrate for radiating heat generated in the wiring substrate, wherein the heat radiation plate is disposed on a connection portion side of the substrate. ### Claim 5 (depends on 1) The device according to claim 1, further comprising: a heat sink disposed on a connection portion side of the substrate; and a resin mold, wherein the lead frame and the heat sink are thermally connected, and the resin mold seals the first and the second electric parts, the wiring substrate, the lead frame and the heat sink in such a manner that a part of the heat sink and a part of the lead frame are exposed from the resin mold. ### Claim 6 (depends on 5) The device according to claim 5, wherein the lead frame and the heat sink are integrated with each other. ### Claim 7 (depends on 1) The device according to claim 1, wherein the wiring substrate is a laminated substrate having a plurality of layers, and one of the layers in the wiring substrate is shorter than the other layers so that the grooves are provided, the one being disposed utmost outside of the wiring substrate. ### Claim 8 (depends on 1) The device according to claim 1, wherein the wiring substrate is a laminated substrate having a plurality of layers, and one of the layers in the wiring substrate has a concavity so that the grooves are provided, the one being disposed utmost outside of the wiring substrate.