# US 7,612,127 B2 · Curable resin composition > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 7,612,127 B2 - Document ID: US7612127B2 - Status: Granted - Kind: B2 - Application number: 10/583,449 - Filed: 2004-12-21 - Published: 2007-06-21 - Granted: 2009-11-03 - Earliest claimed: 2003-12-22 - Assignees: Denki Kagaku Kogyo Kabushiki Kaisha - Inventors: Kazuhiro Oshima; Yoichi Ogata - Web page: https://patentgrep.com/patent/US7612127B2 ## CPC - C09J 133/06: of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical - C08F 2/44: Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers - C08F 20/26: Esters containing oxygen in addition to the carboxy oxygen - H10W 74/47: comprising organic materials, e.g. plastics or resins - H10W 74/473: {containing a filler} - C08F 230/085: {the monomer being a polymerisable silane, e.g. (meth)acryloyloxy trialkoxy silanes or vinyl trialkoxysilanes} - C08K 3/22: of metals - C08K 5/14: Peroxides - C08K 7/00: Use of ingredients characterised by shape - C09J: ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES (preparation of glue or gelatine C09H) - C08F: MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - C08K: Use of inorganic or non-macromolecular organic substances as compounding ingredients (paints, inks, varnishes, dyes, polishes, adhesives C09) ## Abstract It is to provide a curable resin composition which is curable at room temperature, has fluidity, is excellent in workability and provides a cured product having high thermal conductivity and being excellent in flexibility. A curable resin composition comprising a (meth)acrylate monomer, an organic peroxide, a decomposition accelerator for the organic peroxide, and an inorganic filler, wherein the inorganic filler has a particle size distribution such that it has peak diameters at least in the respective regions of from 3 to 10 μm and from 30 to 70 μm, and the mode diameter is from 30 to 70 μm and the median diameter is from 5 to 40 μm. ## Claims ### Claim 1 A curable resin composition comprising a (meth)acrylate monomer, an organic peroxide, a decomposition accelerator for the organic peroxide, and an inorganic filler, wherein the inorganic filler has a particle size distribution such that it has peak diameters at least in the respective regions of from 3 to 10 μm and from 30 to 70 μm, and the mode diameter is from 30 to 70 μm and the median diameter is from 5 to 40 μm. ### Claim 2 A curable resin composition comprising a (meth)acrylate monomer, an organic peroxide, a decomposition accelerator for the organic peroxide and an inorganic filler, wherein the inorganic filler has a particle size distribution such that it has peak diameters at least in the respective regions of from 0.2 to 1.5 μm, from 3 to 10 μm and from 30 to 70 μm, and the mode diameter is from 30 to 70 μm and the median diameter is from 5 to 40 μm. ### Claim 3 (depends on 1) The curable resin composition according to claim 1, which comprises from 0.5 to 10 parts by mass of the organic peroxide, from 0.1 to 10 parts by mass of the decomposition accelerator and from 100 to 1,500 parts by mass of the inorganic filler, respectively, per 100 parts by mass of the (meth)acrylate monomer. ### Claim 4 (depends on 1) The curable resin composition according to claim 1, which further contains a drying oil. ### Claim 5 (depends on 2) The curable resin composition according to claim 2, which further contains a drying oil. ### Claim 6 (depends on 4) The curable resin composition according to claim 4, which comprises from 1 to 30 parts by mass of the drying oil, from 0.5 to 10 parts by mass of the organic peroxide, from 0.1 to 10 parts by mass of the decomposition accelerator and from 100 to 1,500 parts by mass of the inorganic filler, respectively, per 100 parts by mass of the (meth)acrylate monomer. ### Claim 7 (depends on 1) The curable resin composition according to claim 1, wherein the inorganic filler is spherical alumina. ### Claim 8 (depends on 1) A cured product made of the curable resin composition as defined in claim 1. ### Claim 9 (depends on 1) A potting material made of the curable resin composition as defined in claim 1. ### Claim 10 (depends on 1) An adhesive made of the curable resin composition as defined in claim 1. ### Claim 11 (depends on 2) The curable resin composition according to claim 2, which comprises from 0.5 to 10 parts by mass of the organic peroxide, from 0.1 to 10 parts by mass of the decomposition accelerator and from 100 to 1,500 parts by mass of the inorganic filler, respectively, per 100 parts by mass of the (meth)acrylate monomer. ### Claim 12 (depends on 5) The curable resin composition according to claim 5, which comprises from 1 to 30 parts by mass of the drying oil, from 0.5 to 10 parts by mass of the organic peroxide, from 0.1 to 10 parts by mass of the decomposition accelerator and from 100 to 1,500 parts by mass of the inorganic filler, respectively, per 100 parts by mass of the (meth)acrylate monomer. ### Claim 13 (depends on 2) The curable resin composition according to claim 2, wherein the inorganic filler is spherical alumina. ### Claim 14 (depends on 2) A cured product made of the curable resin composition as defined in claim 2. ### Claim 15 (depends on 2) A potting material made of the curable resin composition as defined in claim 2. ### Claim 16 (depends on 2) An adhesive made of the curable resin composition as defined in claim 2. ### Claim 17 (depends on 1) The curable resin according to claim 1, wherein the (meth)acrylate monomer has at least one phenyl group. ### Claim 18 (depends on 2) The curable resin according to claim 2, wherein the (meth)acrylate monomer has at least one phenyl group. ### Claim 19 (depends on 1) The curable resin composition according to claim 1, wherein the inorganic filler has a particle size distribution such that it has peak diameters at least in the respective regions of from 3 to 10 μm and from 30 to 39.8 μm. ### Claim 20 (depends on 2) The curable resin composition according to claim 2, wherein the inorganic filler has a particle size distribution such that it has peak diameters at least in the respective regions of from 0.2 to 1.5 μm, from 3 to 10 μm and from 30 to 39.8 μm.