# US 7,611,982 B2 · Method of forming sheet having foreign material portions used for forming multi-layer wiring board and sheet having foreign portions

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- Number: US 7,611,982 B2
- Document ID: US7611982B2
- Status: Granted
- Kind: B2
- Application number: 10/553,517
- Filed: 2004-04-14
- Published: 2006-10-05
- Granted: 2009-11-03
- Earliest claimed: 2003-04-15
- Assignees: TDK Corporation
- Inventors: Masayuki Yoshida; Shunji Aoki; Junichi Sutoh; Genichi Watanabe
- Web page: https://patentgrep.com/patent/US7611982B2

## CPC

- H05K 1/16: incorporating printed electric components, e.g. printed resistors, capacitors or inductors
- H01F 17/0013: {with stacked layers}
- H05K 1/0306: {Inorganic insulating substrates, e.g. ceramic, glass}
- H05K 1/162: {incorporating printed capacitors}
- H05K 1/165: {incorporating printed inductors}
- H05K 3/4611: {by laminating two or more circuit boards (H05K3/4652 takes precedence)}
- H05K 3/4629: {laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets}
- H05K 2201/0187: with regions of different dielectrics in the same layer, e.g. in a printed capacitor for locally changing the dielectric properties
- H05K 2203/0156: Temporary polymeric carrier or foil, e.g. for processing or transferring
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H01F: MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES

## Abstract

The present invention relates to a laminated type electronic part and aims at providing a sheet manufacturing method and a sheet that contribute to high integration, downsizing and enhancement of reliability of the electronic part. To accomplish this object, the manufacturing method according to the present invention involves forming a layer composed of a positive resist on a support body, repeatedly executing an exposure process, a developing process and a depositing process of depositing a substance having a desired electrical characteristic into an obtained pattern space with respect to the layer, and thereafter removing the support body. The sheet composed of portions, having three or more types of different physical properties, of which an aspect ratio in pattern is equal to or larger than 1, is provided by this manufacturing method.

## Claims

### Claim 1

A sheet forming method of forming a sheet used as each layer when forming a laminated electronic part, comprising:
a step of depositing a photosensitive substance of which an exposed portion is removed by a developer up to a predetermined thickness onto a support body;
a step of executing an exposure process for forming a predetermined pattern upon the photosensitive substance, executing a process for development-removing the pattern subjected to the exposure process by use of the developer, executing an electro-depositing process using a substance having an electrical characteristic onto the portion with the photosensitive substance removed, and forming said sheet or part of said sheet on said support body; and
a step of removing said support body from said sheet,
wherein said step consisting of the exposure process, the developing process and the electro-depositing process is repeated a plural number of times.

### Claim 2

A sheet forming method, of forming a sheet used as each layer when forming a laminated electronic part, comprising:
a step of depositing a photosensitive substance of which an exposed portion is removed by a developer up to a predetermined thickness onto a support body;
a step of executing an exposure process for forming a predetermined pattern upon the photosensitive substance, executing a process for development-removing the pattern subjected to the exposure process by use of the developer, executing a process of depositing a substance having an electrical characteristic onto the portion with the photosensitive substance removed, and forming said sheet or part of said sheet on said support body; and
a step of removing said support body from said sheet,
wherein said step consisting of the exposure process, the developing process and the depositing process includes a process of making residual a part of the portion with the photosensitive substance removed in a way that stops the depositing process halfway, and depositing the photosensitive substance in place of the substance having the electrical characteristic on the residual part.

### Claim 3

A sheet forming method of forming a sheet used as each layer when forming a laminated electronic part, comprising:
a step of depositing a photosensitive substance of which an exposed portion is removed by a developer up to a predetermined thickness onto a support body;
a step of executing an exposure process for forming a predetermined pattern upon the photosensitive substance, executing a process for development-removing the pattern subjected to the exposure process by use of the developer to form a first pattern space, executing a process of depositing a first substance having a first electrical characteristic onto the first pattern space so that a part of the first pattern space is rendered residual as a residual portion, depositing a second substance which has a second electronic characteristic and of which an unexposed portion is removed by the developer, onto the residual portion, forming a second pattern space by exposing and developing the second substance, depositing first, second, or other substance into the second pattern space, and thus forming said sheet or part of said sheet on said support body; and
a step of removing said support body from said sheet.