# US 7,611,923 B2 · Method and apparatus for forming stacked die and substrate structures for increased packing density

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- Number: US 7,611,923 B2
- Document ID: US7611923B2
- Status: Granted
- Kind: B2
- Application number: 11/740,962
- Filed: 2007-04-27
- Published: 2007-08-23
- Granted: 2009-11-03
- Earliest claimed: 2005-05-05
- Assignees: International Business Machines Corporation
- Inventors: Benjamin V. Fasano; Brian R. Sundlof
- Web page: https://patentgrep.com/patent/US7611923B2

## CPC

- H10W 90/00: Package configurations
- H10W 72/07251: {characterised by changes in properties of the bump connectors during connecting}
- H10W 72/20: Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
- H10W 72/877: {Bump connectors and die-attach connectors}
- H10W 90/22: the stacked chips being on both top and bottom sides of a package substrate, interposer or RDL
- H10W 90/288: {characterised by arrangements for thermal management of the stacked chips}
- H10W 90/721: {of bump connectors}
- H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

A stacked semiconductor apparatus has at least one die attached to a first side of a carrier substrate. A first circuitized substrate is attached to the first side of the carrier substrate and overlying the at least one die in a manner such that the first circuitized substrate serves as an electrical interconnection device and a heat spreading lid. The first circuitized substrate is further configured so as to facilitate cooling of the at least one die by at least a cross flow of a cooling medium therethrough.

## Claims

### Claim 1

A method for forming a stacked semiconductor apparatus, the method comprising:
attaching at least one die to a first side of a carrier substrate;
attaching a first circuitized substrate to said first side of said carrier substrate so as to overlie said at least one die attached to said first side of said carrier substrate in a manner such that said first circuitized substrate serves as an electrical interconnection device and a heat spreading lid; and
configuring said first circuitized substrate further so as to facilitate cooling of said at least one die attached to said first side of said carrier substrate by at least the introduction of a cross flow of a cooling medium therethrough.

### Claim 2 (depends on 1)

The method of claim 1, wherein the perimeter of said first circuitized substrate is shaped such that a step height is created at a center portion thereof.

### Claim 3 (depends on 1)

The method of claim 1, further comprising a thermal heat spreading material disposed between the top surface of said at least one die attached to said first side of said carrier substrate and the bottom surface of said first circuitized substrate.

### Claim 4 (depends on 1)

The method of claim 1, further comprising a heat spreading device attached to the top of said at least one die attached to said first side of said carrier substrate, said heat spreading device extending beyond the width of said first circuitized substrate and having upwardly disposed fins on the outer edges thereof.

### Claim 5 (depends on 1)

The method of claim 1, further comprising:
attaching at least one die to a second side of said carrier substrate such that the top surface of said at least one die attached to said second side of said carrier substrate is oriented in a downward direction with respect to said at least one die attached to said first side of said carrier substrate; and
attaching a second circuitized substrate to said second side of said carrier substrate and overlying said at least one die attached to said second side of said carrier substrate in said downward direction in a manner such that said second circuitized substrate serves as a electrical interconnection device and a heat spreading lid.

### Claim 6 (depends on 1)

The method of claim 1, further comprising configuring said first circuitized substrate to receive one or more additional die and circuitized substrate assemblies attached thereupon in a stacked configuration.

### Claim 7 (depends on 1)

The method of claim 1, further comprising:
attaching at least one die attached to the bottom of said first circuitized substrate; and
applying a thermal heat spreading material between the top of said at least one die attached to the bottom side of said first circuitized substrate and the top of said at least one die attached to said first side of said carrier substrate so as to define a die stack between said first side of said carrier substrate and said first circuitized substrate.

### Claim 8 (depends on 1)

The method of claim 1, wherein said first circuitized substrate has a width less than that of said carrier substrate.

### Claim 9 (depends on 1)

The method of claim 1, further comprising attaching said first circuitized substrate to said carrier substrate through by an electrically conductive grid array attachment.