# US 7,611,826 B2 · Photosensitive resin composition controlling solubility and pattern formation method of double-layer structure using the same > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 7,611,826 B2 - Document ID: US7611826B2 - Status: Granted - Kind: B2 - Application number: 12/351,398 - Filed: 2009-01-09 - Published: 2009-07-30 - Granted: 2009-11-03 - Earliest claimed: 2002-10-04 - Assignees: Samsung Electronics Co., Ltd. - Inventors: Seok-Yoon Yang; Gil-Lae Kim; Chan-Seok Park; Choon-Ho Park; Soo-Guy Rho - Web page: https://patentgrep.com/patent/US7611826B2 ## CPC - G03F 7/032: with binders - G03F 7/0007: {Filters, e.g. additive colour filters; Components for display devices} - G03F 7/0751: {used as adhesion-promoting additives or as means to improve adhesion} - Y10S 430/106: Binder containing - G03F: PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR; (phototypographic composing devices B41B; photosensitive materials or processes for photographic purposes G03C; electrophotography, sensitive layers or processes therefor G03G) - Y10S: TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS ## Abstract The present invention relates to a new photosensitive resin composition capable of solubility control and a pattern formation method of a double-layer structure using the same, and more particularly to a photosensitive resin composition that can control the -value using a new photopolymerization initiator and lower layer hardener and that can control a film thickness according to the exposure energy without pattern breakup, even with low exposure energy. This photosensitive resin composition is useful for color filters and overcoating materials of LCD (liquid crystal display) manufacturing processes. ## Claims ### Claim 1 A method of forming a double-layer pattern for display devices, the method comprising: coating a photosensitive resin composition on a substrate to form a coating layer, the photosensitive resin compositing containing a lower layer hardener capable of hardening a lower portion of the coating layer; exposing light to the coating layer through a photomask having a slit pattern so as to cause unsaturated light-exposure through the slit pattern; and developing the light-exposed coating layer, wherein an upper portion of the coating layer is removed due to the unsaturated light-exposure and the lower portion of the coating layer hardened by the lower layer hardener remains, thereby differentiating the thickness of the developed coating layer to have a γ-value of not more than 2.5 after development. ### Claim 2 (depends on 1) The method as claimed in claim 1, wherein the slit pattern includes a light-passing portion (WL) having a width of 1 to 100 μm in x- and y-axes. ### Claim 3 (depends on 1) The method as claimed in claim 1, wherein the slit pattern includes a light-blocked portion (BS) having a width of 1 to 100 μm in x- and y-axes. ### Claim 4 (depends on 1) The method as claimed in claim 1, wherein the slit pattern includes a lattice pattern wherein the width of the light-passing portion (WL) is 1 to 100 μm in x- and y-axes. ### Claim 5 (depends on 1) The method as claimed in claim 1, wherein the slit pattern includes a lattice pattern wherein the width of the light-blocked portion (BS) is 1 to 100 μm in x- and y-axes. ### Claim 6 (depends on 1) The method as claimed in claim 1, wherein the photosensitive resin composition includes: a) 5 to 30 wt % of a binder soluble in an alkaline solution; b) 5 to 30 wt % of a crosslinking monomer having at least two ethylene double bonds; c) 10 to 60 wt % of pigment; d) 1 to 5 wt % of one or more photopolymerization initiators selected from the group consisting of an acetophenone compound, a xanthone compound, a benzoin compound, and an imidazole compound; and e) 20 to 80 wt % of a solvent, and wherein the lower layer hardener includes 0.1 to 2 wt % of 3-acryloxypropyltrimethoxysilane. ### Claim 7 (depends on 6) The method as claimed in claim 6, wherein the binder soluble in an alkaline solution is a copolymer of 10 to 40 wt % of monomers having ethylene acidic groups and 60 to 90 wt % of monomers having no ethylene acidic group. ### Claim 8 (depends on 7) The method as claimed in claim 7, wherein the monomers having ethylene acidic groups are selected from the group consisting of acrylic acid, methacrylic acid, itaconic acid, maleic acid, fumaric acid, vinyl acetic acid, and acid anhydrides thereof, and 2-acryloxyethylhydrogen phthalate, 2-acryloxypropylhydrogen phthalate, and 2-acryloxypropylhexahydrogen phthalate. ### Claim 9 (depends on 7) The method as claimed in claim 7, wherein the monomers having no ethylene acidic group are selected from the group consisting of isobutyl acrylate, tert-butyl acrylate, lauryl acrylate, alkyl acrylate, stearyl acrylate, cyclohexyl acrylate, isobornyl acrylate, benzyl acrylate, 2-hydroxy acrylate, trimethoxybutyl acrylate, ethylcarbitol acrylate, phenoxyethyl acrylate, 4-hydroxybutyl acrylate, phenoxypolyethyleneglycol acrylate, 2-hydroxyethyl acrylate, 2-hydroxypropyl acrylate, 2-acryloxyethyl-2-hydroxypropyl phthalate, 2-hydroxy-3-phenoxypropyl acrylate, and methacrylates thereof; acrylates having a halogen atom and methacrylates thereof; acrylates having s siloxane group and methacrylates thereof; and aromatic olefins. ### Claim 10 (depends on 6) The method as claimed in claim 6, wherein the crosslinking monomer having at least two ethylene double bonds is one or more compounds selected from the group consisting of 1,4-butanediol diacrylate, 1,3-butyleneglycol diacrylate, ethyleneglycol diacrylate, pentaerythritol tetraacrylate, triethyleneglycol diacrylate, polyethyleneglycol diacrylate, dipentaerythritol diacrylate, sorbitol triacrylate, bisphenol A diacrylate derivatives, trimethylolpropane triacrylate, dipentaerythritolpoly acrylate, and methacrylates thereof. ### Claim 11 (depends on 6) The method as claimed in claim 6, wherein the pigment is an organic pigment or an inorganic pigment. ### Claim 12 (depends on 6) The method as claimed in claim 6, wherein the solvent is one or more compounds selected from the group consisting of ethyleneglycol monomethyl ether acetate, propyleneglycol monomethyl ether, propyleneglycol methyl ether acetate, propyleneglycol monoethyl ether acetate, diethyleneglycol dimethyl ether, diethyleneglycol methylethyl ether, cyclohexanone, 3-methoxyethyl propionate, 3-ethoxymethyl propionate, and 3-ethoxyethyl propionate. ### Claim 13 (depends on 6) The method as claimed in claim 6, wherein the ethylene monomer having at least one epoxy group or oligomer thereof is one or more compounds selected from the group consisting of glycidyl acrylate, glycidyl methacrylate, glycidylethyl acrylate, glycidylethyl methacrylate, glycidylpropyl acrylate, glycidylpropyl methacrylate, 3,4-epoxybutyl methacrylate, 3,4-epoxybutyl acrylate, and oligomers thereof. ### Claim 14 (depends on 6) The method as claimed in claim 6, wherein the photosensitive resin composition further includes: 0.01 to 1 wt % of a disperser for improving dispersion of the pigment and an additive for improving coatability, which is one or more compounds selected from the group consisting of a polyester disperser, a polyurethane disperser, a silicon surfactant, and a fluorine surfactant.