# US 7,611,821 B2 · Positive resist compositions and patterning process

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- Number: US 7,611,821 B2
- Document ID: US7611821B2
- Status: Granted
- Kind: B2
- Application number: 11/774,300
- Filed: 2007-07-06
- Published: 2008-01-10
- Granted: 2009-11-03
- Earliest claimed: 2006-07-06
- Assignees: Shin-Etsu Chemical Co., Ltd.
- Inventors: Tsunehiro Nishi; Takeshi Kinsho
- Web page: https://patentgrep.com/patent/US7611821B2

## CPC

- G03F 7/0392: {the macromolecular compound being present in a chemically amplified positive photoresist composition}
- G03F 7/0046: {with perfluoro compounds, e.g. for dry lithography (G03F7/0048 takes precedence)}
- G03F 7/0397: {the macromolecular compound having an alicyclic moiety in a side chain}
- G03F 7/2041: {in the presence of a fluid, e.g. immersion; using fluid cooling means}
- Y10S 430/114: Initiator containing
- G03F: PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR; (phototypographic composing devices B41B; photosensitive materials or processes for photographic purposes G03C; electrophotography, sensitive layers or processes therefor G03G)
- Y10S: TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS

## Abstract

A positive resist composition is provided comprising (A) a resin component having a carboxylic acid moiety protected with an acetal protective group which is decomposable under the action of an acid, wherein in the carboxylic acid moiety protected with an acetal protective group, deprotection occurs not by way of β-elimination, and (B) a photoacid generator. The resist composition exhibits a high resolution when processed by ArF lithography.

## Claims

### Claim 1

A positive resist composition comprising
(A) a resin component, and
(B) a compound which generates an acid in response to actinic light or radiation,
said resin compound comprising recurring units of the following formula:
recurring units of the following formula:
and recurring units selected from the group consisting of the following formulae:
wherein R is hydrogen atom or methyl group.

### Claim 2 (depends on 1)

The positive resist composition of claim 1, wherein said resin component further comprises recurring units of the following formula:
wherein R is hydrogen atom or methyl group.