# US 7,611,807 B2 · Method for forming poly-silicon film

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- Number: US 7,611,807 B2
- Document ID: US7611807B2
- Status: Granted
- Kind: B2
- Application number: 11/368,616
- Filed: 2006-03-07
- Published: 2007-06-21
- Granted: 2009-11-03
- Earliest claimed: 2005-12-19
- Assignees: Industrial Technology Research Institute
- Inventors: Hung-Tse Chen; Yu-Cheng Chen; Fang-Tsun Chu
- Web page: https://patentgrep.com/patent/US7611807B2

## CPC

- H10P 34/42: with electromagnetic radiation, e.g. laser annealing (laser cutting H10P54/20)
- H10P 14/3411: {Silicon, silicon germanium or germanium}
- H10P 14/3812: {Shape of mask}
- H10P 14/382: {Scanning of a beam}
- H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10

## Abstract

In the present invention, a method is used for forming a poly-silicon film that uses sequential lateral solidification (SLS) with two laser irradiations using a mask for patterning the laser beam so as to increase the grain length. The method also achieves enhancing the throughput due to the use of a mask that is designed for the method.

## Claims

### Claim 1

A method for forming a poly-silicon film, comprising steps of:
providing a system for forming a poly-silicon film, comprising
a laser generator for generating a laser beam; and
a mask disposed in a traveling path of said laser beam, said mask including a plurality of first transparent regions with a spacing S and a plurality of second transparent regions with a spacing S, each transparent region having a width W and a length L, wherein said first transparent regions are adjacent to said second transparent regions and a central line of each first transparent region extends along said length L into one of said second transparent regions such that an offset width OS appears between said first transparent regions and said second transparent regions, wherein said offset width OS is smaller than a half of said width W;
providing a substrate with an amorphous silicon film formed thereon behind said mask in said traveling path of said laser beam;
performing a first laser irradiation process on said amorphous silicon film using said laser beam irradiating through said mask so as to melt said amorphous silicon film in a plurality of first stripe-shaped regions corresponding to said first transparent regions on said mask;
removing said laser beam such that said melted amorphous silicon film in said first stripe-shaped regions turns into a poly-silicon film with a first grain length;
moving said substrate along said length L for a distance no longer than said length L such that said plurality of first stripe-shaped regions correspond to said plurality of second transparent regions on said mask;
performing a second laser irradiation process on said poly-silicon film using said laser beam irradiating through said mask so as to re-melt said poly-silicon film in a plurality of first swipe-shaped regions corresponding to said second transparent regions on said mask; and
removing said laser beam such that said re-melted poly-silicon film in said first stripe-shaped regions turns into a poly-silicon film with a second grain length.

### Claim 2 (depends on 1)

The method as recited in claim 1, wherein said second grain length is (W+S).

### Claim 3 (depends on 1)

The method as recited in claim 1, wherein said system further comprises a projection lens apparatus with an amplification factor of N, said projection lens apparatus being disposed on said traveling path of said laser beam between said substrate and said mask.

### Claim 4 (depends on 3)

The method as recited in claim 3, wherein said second grain length is (W+S)/N.

### Claim 5

A mask for forming a poly-silicon film, comprising:
a plurality of first transparent regions with a spacing S and a plurality of second transparent regions with a spacing 5, each transparent region having a width W and a length L;
wherein said first transparent regions are adjacent to said second transparent regions and a central line of each first transparent region extends along said length L into one of said second transparent regions such that an offset width OS appears between said first transparent regions and said second transparent regions;
wherein said offset width OS is smaller than a half of said width W.