# US 7,611,617 B2 · Method of manufacturing a dielectric component, and dielectric components manufactured by such a method

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- Number: US 7,611,617 B2
- Document ID: US7611617B2
- Status: Granted
- Kind: B2
- Application number: 11/685,050
- Filed: 2007-03-12
- Published: 2007-12-13
- Granted: 2009-11-03
- Earliest claimed: 2006-03-10
- Assignees: Spectrum Control, Inc.
- Inventors: Jeffrey D. Chereson; Rob Ehrensberger; Michael Boudreaux
- Web page: https://patentgrep.com/patent/US7611617B2

## CPC

- H01G 4/06: Solid dielectrics
- C25D 5/02: Electroplating of selected surface areas
- C25D 5/54: Electroplating of non-metallic surfaces (C25D7/12 takes precedence)
- H01G 4/005: Electrodes
- H01G: CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE (selection of specified materials as dielectric H01B3/00; capacitors having potential barriers H10D1/62, H10K10/10)
- C25D: PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR

## Abstract

A method of forming a dielectric component, such as a capacitor is disclosed. In such a method, a conductive surface is applied to a dielectric to form a coated dielectric. Then a portion of the conductive surface is removed from the coated dielectric to form at least two electrically isolated conductive areas.

## Claims

### Claim 1

A method of forming a capacitor, comprising:
applying a conductive surface to a curved surface of a dielectric to form a coated dielectric; and
removing a portion of the conductive surface from the coated dielectric to form at least two electrically isolated conductive areas, wherein removing a portion of the conductive surface includes:
placing a deposition object proximate to the portion of the conductive surface to be removed;
electrically connecting the coated dielectric to a voltage source in order to make the coated dielectric an anode;
electrically connecting the deposition object to a voltage source in order to make the deposition object a cathode;
permitting a portion of the conductive surface from the coated dielectric to deposit on the deposition object.

### Claim 2 (depends on 1)

The method of claim 1, wherein applying the conductive surface includes electro-plating.

### Claim 3 (depends on 2)

The method of claim 2, wherein electro-plating is carried out by:
placing the dielectric material in an electrolyte;
electrically connecting the dielectric to a voltage source in order to make the dielectric a cathode;
placing a conductive material in the electrolyte;
electrically connecting the conductive material to a voltage source in order to make the conductive material an anode;
permitting the conductive material to deposit on the dielectric material.

### Claim 4 (depends on 1)

The method of claim 1, wherein the dielectric material is substantially annularly shaped.

### Claim 5 (depends on 4)

The method of claim 4, wherein one of the conductive areas resides at least in part on an inner curved surface of the dielectric material.

### Claim 6 (depends on 4)

The method of claim 4, wherein one of the conductive areas resides at least in part on an outer curved surface of the dielectric material.

### Claim 7 (depends on 4)

The method of claim 4, wherein a first one of the conductive areas covers a portion of an inner curved surface of the dielectric material and also a portion of an outer curved surface of the dielectric material.

### Claim 8 (depends on 7)

The method of claim 7, wherein a second one of the conductive areas covers a portion of the inner curved surface of the dielectric material and also a portion of the outer curved surface of the dielectric material.

### Claim 9 (depends on 4)

The method of claim 4, wherein one of the conductive areas resides on a substantially flat portion of the dielectric material.

### Claim 10 (depends on 9)

The method of claim 9, wherein another of the conductive areas resides on a substantially flat portion of the dielectric material.