# US 7,611,616 B2 · Mesoscale and microscale device fabrication methods using split structures and alignment elements > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 7,611,616 B2 - Document ID: US7611616B2 - Status: Granted - Kind: B2 - Application number: 11/506,586 - Filed: 2006-08-18 - Published: 2007-02-22 - Granted: 2009-11-03 - Earliest claimed: 2002-05-07 - Assignees: Microfabrica Inc. - Inventors: Adam L. Cohen; Michael S. Lockard; Dennis R. Smalley - Web page: https://patentgrep.com/patent/US7611616B2 ## CPC - C25D 1/003: {3D structures, e.g. superposed patterned layers} - B33Y 10/00: Processes of additive manufacturing - B81C 1/00293: {maintaining a controlled atmosphere with processes not provided for in B81C1/00285} - B81C 1/00333: {Aspects relating to packaging of MEMS devices, not covered by groups B81C1/00269 - B81C1/00325} - C25D 1/10: Moulds; Masks; Masterforms - C25D 5/022: {using masking means} - G01P 15/0802: {Details} - G01P 15/125: by capacitive pick-up - H01P 1/202: Coaxial filters (cascaded coaxial cavities H01P1/205) - H01P 3/06: Coaxial lines - H01P 5/183: {at least one of the guides being a coaxial line} - H01P 11/00: Apparatus or processes specially adapted for manufacturing waveguides or resonators, lines, or other devices of the waveguide type - H01P 11/005: {Manufacturing coaxial lines} - B81B 2201/042: Micromirrors, not used as optical switches - B81C 2201/0197: Processes for making multi-layered devices not provided for in groups B81C2201/0176 - B81C2201/0192 - B81C 2203/0145: Hermetically sealing an opening in the lid - H05K 3/4647: {by applying an insulating layer around previously made via studs} - Y10T 156/10: Methods of surface bonding and/or assembly therefor - C25D: PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR - B33Y: ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING - B81C: PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS (making microcapsules or microballoons B01J13/02; processes or apparatus specially adapted for the manufacture or treatment of piezoelectric, electrostrictive or magnetostrictive elements per se H10N30/01) - G01P: MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT (measuring or recording blood flow A61B5/02, A61B8/06; monitoring speed or deceleration of electrically-propelled vehicles B60L3/00; vehicle lighting systems adapted to indicate speed B60Q1/54; determining position or course in navigation, measuring ground distance in geodesy or surveying G01C; combined measuring devices for measuring two or more variables of movement G01C23/00; measuring velocity of sound G01H; measuring velocity of light G01J7/00; measuring direction or velocity of solid objects by reception or emission of radiowaves or other waves and based on propagation effects, e.g. Doppler effect, propagation time, direction of propagation, G01S; measuring speed of nuclear radiation G01T; measuring acceleration of gravity G01V; {measuring or recording the speed of trains B61L23/00; speed indicators incorporated in motor vehicles B60K35/00; measuring frequency or phase G01R; traffic control G08G}) - H01P: WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE (operating at optical frequencies G02B) - B81B: MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES (piezoelectric, electrostrictive or magnetostrictive elements per se H10N30/00, H10N35/00) - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION ## Abstract Various embodiments of the invention are directed to formation of mesoscale or microscale devices using electrochemical fabrication techniques where structures are formed from a plurality of layers as opened structures which can be folded over or other otherwise combined to form structures of desired configuration. Each layer is formed from at least one structural material and at least one sacrificial material. The initial formation of open structures may facilitate release of the sacrificial material, ability to form fewer layers to complete a structure, ability to locate additional materials into the structure, ability to perform additional processing operations on regions exposed while the structure is open, and/or the ability to form completely encapsulated and possibly hollow structures. ## Claims ### Claim 1 A method for forming at least a portion of a three-dimensional device having a desired configuration, comprising: a. forming at least first and second portions of a structure from a plurality of adhered layers of at least one structural material where the first portion has a first surface and the second portion has a second surface where the first and second surfaces are separated from one another during formation of the layers but which are to be located in contact or in proximity to one another in the desired configuration; b. separating the structure from any sacrificial material that would hinder the bringing of the first and second portions into contact or into proximity or which would be effectively trapped if in place when the first and second portions are brought together; and c. rotating at least one of the first and second portions relative to the other to bring the first and second surfaces into contact or into proximity to yield the three-dimensional device, wherein the forming comprises depositing at least one of the at least one structural material or the sacrificial material selectively onto a substrate or previously deposited material via one or more openings in a masking material that is adhered to the substrate or previously deposited material. ### Claim 2 (depends on 1) The method of claim 1 wherein the method additionally comprises: d. after moving the first and second portions into contact or proximity, securing the portions to yield the desired configuration. ### Claim 3 (depends on 2) The method of claim 2 wherein the securing comprises at least one of bonding with solder, bonding with a eutectic material, bonding with gold, encapsulating at least a portion of the first and second portions with a dielectric encapsulant, or engaging one or more locking clips. ### Claim 4 (depends on 1) The method of claim 1 wherein the forming results in said first and second portions being attached to one another by a bendable hinge structure. ### Claim 5 (depends on 4) The method of claim 4 wherein the hinge structure comprises a plurality of hinge structures. ### Claim 6 (depends on 4) The method of claim 4 wherein, the hinge structure comprises a configuration having at least one wider region and at least one narrower region wherein bending preferentially occurs in the narrower region. ### Claim 7 (depends on 1) The method of claim 1 wherein the forming results in said first and second portions being joined to one another by a pivotable hinge structure. ### Claim 8 (depends on 1) The method of claim 1 wherein at least one of the first portion or the second portion includes alignment structures which aid in guiding the first and second surfaces in proximity or in contact. ### Claim 9 (depends on 1) The method of claim 1 wherein at least one of the first portion or the second portion includes alignment structures which aid in ensuring that the first and second portions are properly located after moving. ### Claim 10 A method for forming at least a portion of a three-dimensional device having a desired configuration, comprising: a. forming at least first and second portions of a structure from a plurality of adhered layers of at least one structural material where the first portion has a first surface and the second portion has a second surface where the first and second surfaces are separated from one another during formation of the layers but which are to be located in contact or in proximity to one another in the desired configuration; and b. rotating at least one of the first and second portions relative to the other to bring the first and second surfaces into contact or into proximity, wherein the forming comprises depositing at least one material selectively onto a substrate or previously deposited material via one or more openings in a masking material that is adhered to the substrate or previously deposited material, and wherein the forming comprises forming one or more alignment structures which aid in locating the first and second surfaces in proximity or in contact and/or which aid in guiding the first and second surfaces in proximity or in contact. ### Claim 11 (depends on 10) The method of claim 10 wherein the method additionally comprises: c. after moving the first and second portions into contact or proximity, securing the portions to yield the desired configuration. ### Claim 12 (depends on 11) The method of claim 11 wherein the securing comprises at least one of bonding with solder, bonding with a eutectic material, bonding with gold, encapsulating at least a portion of the first and second portions with a dielectric encapsulant, or engaging one or more locking clips. ### Claim 13 (depends on 10) The method of claim 10 wherein, the forming results in said first and second portions being attached to one another by a bendable hinge structure. ### Claim 14 (depends on 3) The method of claim 3 wherein the hinge structure comprises a plurality of hinge structures. ### Claim 15 (depends on 14) The method of claim 14 wherein the hinge structure comprises a configuration having at least one wider region and at least one narrower region wherein bending preferentially occurs in the narrower region. ### Claim 16 (depends on 10) The method of claim 10 wherein the forming results in said first and second portions being joined to one another by a pivotable hinge structure. ### Claim 17 (depends on 10) The method of claim 10 wherein the alignment structure comprises a plurality of structures which include at least one structure which is bent from a formed position to an alignment guiding position. ### Claim 18 A method for forming at least a portion of a three-dimensional device having a desired configuration, comprising: a. forming at least first, second, and third portions of a structure from a plurality of adhered layers of at least one structural material where the first portion has a first surface and the second portion has a second surface and the third portion has a third surface, where the first, second, surfaces are separated from one another during formation of the layers but which are to be located in contact or in proximity to one another in the desired configuration, and where the third surface is separated from the first and second portions during formation but is to be located in contact or in proximity to a surface of one of the first or second portions; and b. moving at least one of the first and second portions relative to the other to bring the first and second surfaces into contact or into proximity, c. moving at least one of the third or combined first and second portions relative to the other to bring the third and combined first and second portions into contact or into proximity, wherein at least one of the moving steps comprises rotating.