# US 7,611,600 B2 · Sticking apparatus and sticking method > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 7,611,600 B2 - Document ID: US7611600B2 - Status: Granted - Kind: B2 - Application number: 11/587,853 - Filed: 2005-04-27 - Published: 2007-10-04 - Granted: 2009-11-03 - Earliest claimed: 2004-04-28 - Assignees: Lintec Corporation - Inventors: Masaki Tsujimoto; Takahisa Yoshioka; Kenji Kobayashi - Web page: https://patentgrep.com/patent/US7611600B2 ## CPC - H10P 72/0442: {Apparatus for placing on an insulating substrate, e.g. tape} - Y10T 156/108: Flash, trim or excess removal - Y10T 156/11: Methods of delaminating, per se; i.e. , separating at bonding face - Y10T 156/1195: Delaminating from release surface - Y10T 156/12: Surface bonding means and/or assembly means with cutting, punching, piercing, severing or tearing - Y10T 156/16: Surface bonding means and/or assembly means with bond interfering means [slip sheet, etc. ] - Y10T 156/17: Surface bonding means and/or assemblymeans with work feeding or handling means - Y10T 156/19: Delaminating means - Y10T 156/1994: Means for delaminating from release surface - H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10 - Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION ## Abstract A sticking apparatus 10 includes a sticking table 11 supporting a semiconductor wafer W and a sticking unit 12 sticking a heat sensitive adhesive sheet S to the semiconductor wafer W. The sticking unit 12 includes a peeling section that, when paying out a raw sheet L having adhesive sheet S laminated to one side face of a release liner PS, peels off the release liner PS and the adhesive sheet S and a sheet preliminary peeling unit 40 provided at an upstream side of the peeling section in a pay-out direction of the raw sheet. The sheet preliminary peeling unit 40 includes a moving member 50 that moves to and from in a state of being pinched between the release liner PS and the adhesive sheet S. The preliminarily peeled-off release liner PS and adhesive sheet S are temporarily re-bonded by a temporary re-bonding unit 41, enabling to stick the adhesive sheet S on the wafer W. ## Claims ### Claim 1 A sticking apparatus comprising: a sticking table supporting a plate-like member; and a sticking unit that sticks an adhesive sheet to said plate-like member, wherein: said sticking unit includes a peeling section that, in course of paying out a raw sheet in which the adhesive sheet is temporarily laminated to one side face of a release liner, peels off the release liner and the adhesive sheet; and a preliminary peeling unit that is provided at an upstream side of the peeling section in a pay-out direction of the raw sheet; wherein said preliminary peeling unit includes a moving member that is movable in the pay-out direction of the raw sheet; and the moving member moves in a state of being pinched between the release liner and the adhesive sheet. ### Claim 2 A sticking apparatus comprising: a sticking table supporting a plate-like member; and a sticking unit that sticks an adhesive sheet to said plate-like member, wherein: said sticking unit includes a preliminary peeling unit that, in course of paying out a raw sheet in which the adhesive sheet is temporarily bonded to one side face of a release liner, peels off the adhesive sheet from said release liner, a temporary re-bonding unit that re-bonds temporarily the adhesive sheet preliminarily peeled-off to said release liner, and said release liner is pressed by a press roll in a state that said temporarily re-bonded adhesive sheet is directed to a surface of said plate-like member; wherein said preliminary peeling unit includes a moving member that is movable in the pay-out direction of the raw sheet; and the moving member moves in a state of being pinched between the release liner and the adhesive sheet. ### Claim 3 (depends on 1, 2) The sticking apparatus according to claim 1 or 2, wherein: said plate-like member is a semiconductor wafer and said adhesive sheet is a heat sensitive adhesive sheet for die bonding. ### Claim 4 (depends on 1, 2) The sticking apparatus according to claim 1 or 2, wherein: said plate-like member is a semiconductor wafer and said adhesive sheet is a protection sheet that is stuck to form a protection film. ### Claim 5 (depends on 1, 2) The sticking apparatus according to claim 1 or 2, wherein: said moving member is composed of a piece which is provided with a plane along said pay-out direction or a roll-shaped member. ### Claim 6 A sticking method in which a raw sheet having an adhesive sheet bonded temporarily to one side face of a release liner is paid out to stick said adhesive sheet on a plate-like member, comprising the steps of: peeling off the adhesive sheet preliminarily from said release liner in course of paying out said raw sheet with a preliminary peeling unit that includes a moving member that is movable in the pay-out direction of the raw sheet; and the moving member moves in a state of being pinched between the release liner and the adhesive sheet; and then sticking said adhesive sheet to plate-like member by pressing the adhesive sheet to the plate-like member in a state that said adhesive sheet is directed to said plate-like member. ### Claim 7 A sticking method in which a raw sheet having an adhesive sheet bonded temporarily to one side face of a release liner is paid out to stick said adhesive sheet to a plate-like member, comprising the steps of: peeling off the adhesive sheet preliminarily from said release liner in course of paying out said raw sheet with a preliminary peeling unit that includes a moving member that is movable in the pay-out direction of the raw sheet; and the moving member moves in a state of being pinched between the release liner and the adhesive sheet; re-bonding temporarily said adhesive sheet peeled-off preliminarily to said release liner; and then said re-bonded adhesive sheet is directed to said plate-like member. ### Claim 8 (depends on 6, 7) The sticking method according to claim 6 or 7, wherein: said adhesive sheet is a heat sensitive adhesive sheet. ### Claim 9 (depends on 6, 7) The sticking method according to claim 6 or 7, wherein: said adhesive sheet is a protection sheet that is stuck to form a protection film. ### Claim 10 (depends on 6, 7) The sticking method according to claim 6 or 7, wherein: said plate-like member is a semiconductor wafer. ### Claim 11 (depends on 6, 7) The sticking method according to claim 6 or 7, wherein: said plate-like member is a semiconductor wafer that is back-ground. ### Claim 12 (depends on 7) The sticking method according to claim 7, wherein: said temporarily re-bonding step is carried out by imparting heat or static electricity.