# US 7,611,400 B2 · Smart conditioner rinse station

> Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt

- Number: US 7,611,400 B2
- Document ID: US7611400B2
- Status: Granted
- Kind: B2
- Application number: 11/741,609
- Filed: 2007-04-27
- Published: 2007-09-06
- Granted: 2009-11-03
- Earliest claimed: 2005-05-26
- Assignees: Applied Materials, Inc.
- Inventors: Alpay Yilmaz; Lakshmanan Karuppiah
- Web page: https://patentgrep.com/patent/US7611400B2

## CPC

- B24B 53/017: Devices or means for dressing, cleaning or otherwise conditioning lapping tools
- H10P 72/0414: {using mainly spraying means, e.g. nozzles}
- H10P 72/0428: {Apparatus for mechanical treatment or grinding or cutting}
- H10P 72/0604: {Process monitoring, e.g. flow or thickness monitoring}
- B24B: MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING (grinding of gear teeth B23F, of screw-threads B23G1/36; by electro-erosion B23H; abrasive or related blasting B24C; tools for grinding, buffing or sharpening B24D; polishing compositions C09G1/00; abrasives C09K3/14; electrolytic etching or polishing C25F3/00; grinding arrangements for use on assembled railway tracks E01B31/17); DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10

## Abstract

A method and apparatus for monitoring polishing pad conditioning mechanisms is provided. In one embodiment, a semiconductor substrate polishing system includes a rinse station, a polishing surface, a conditioning element, and a conditioning mechanism. The conditioning mechanism selectively positions the conditioning element over the polishing surface and over the rinse station. At least one sensor is provided and is configured to detect a first position and a second position of the conditioning element when disposed over the rinse station.

## Claims

### Claim 1

A semiconductor substrate polishing system, comprising:
a polishing surface configured to polish a semiconductor substrate;
a conditioning mechanism configured to condition the polishing surface, wherein the conditioning mechanism comprises a conditioning element configured to contact the polishing surface during conditioning;
a rinse station configured to spray cleaning fluid on the conditioning element; and
a sensor assembly configured to sense an attribute of the conditioning mechanism, wherein the attribute is indicative of performance of the conditioning element and the sensor assembly comprises:
a first sensor configured to detect a first position of the conditioning element; and
a second sensor configured to detect a second position of the conditioning element, wherein the sensor assembly is positioned in the rinse station.

### Claim 2

A method for characterizing a component of a conditioning mechanism, comprising:
interfacing a conditioning mechanism disposed in a polishing system with one or more sensors, wherein the conditioning mechanism is adapted to move between a conditioning position and a non-conditioning position within the polishing system;
obtaining a metric indicative of conditioning mechanism performance from the one or more sensors, wherein the obtaining the metric indicative of conditioning mechanism comprises:
detecting a first position of the conditioning mechanism using a first sensor; and
detecting a second position of the conditioning mechanism using a second sensor; and
determining if the metric of performance is within a process window.

### Claim 3 (depends on 2)

The method of claim 2, wherein the obtaining the metric indicative of conditioning mechanism performance further comprises:
evaluating a conditioning surface of a conditioning element of the conditioning mechanism.

### Claim 4 (depends on 2)

The method of claim 2, wherein the first position of the conditioning mechanism and second position of the conditioning mechanism are predefined.

### Claim 5 (depends on 2)

The method of claim 2, wherein the obtaining the metric indicative of conditioning mechanism performance further comprises:
detecting a downforce of the conditioning mechanism.

### Claim 6 (depends on 2)

The method of claim 2, wherein the obtaining the metric indicative of conditioning mechanism performance further comprises:
detecting a cut-rate of the conditioning mechanism.

### Claim 7

A method for characterizing a component of a conditioning mechanism, comprising:
interfacing a conditioning mechanism disposed in a non-conditioning position with one or more sensors;
obtaining a metric indicative of conditioning mechanism performance from the one or more sensors, wherein the obtaining the metric indicative of conditioning mechanism performance further comprises detecting a cut-rate of the conditioning mechanism; and
determining if the metric of performance is within a process window.