# US 7,610,675 B2 · Method to produce a transponder

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- Number: US 7,610,675 B2
- Document ID: US7610675B2
- Status: Granted
- Kind: B2
- Application number: 10/831,209
- Filed: 2004-04-26
- Published: 2004-10-28
- Granted: 2009-11-03
- Earliest claimed: 2003-04-25
- Assignees: Assa Abloy AB
- Inventors: Fredrik Hansson; Mattias Persson
- Web page: https://patentgrep.com/patent/US7610675B2

## CPC

- H01F 27/40: Structural association with built-in electric component, e.g. fuse
- H01F 41/076: Forming taps or terminals while winding, e.g. by wrapping or soldering the wire onto pins, or by directly forming terminals from the wire
- H01F 41/09: Winding machines having two or more work holders or formers
- H01F 41/10: Connecting leads to windings (making electric connections in general H01R43/00)
- Y10T 29/49004: including measuring or testing of device or component part
- Y10T 29/49018: with other electrical component
- Y10T 29/49073: by assembling coil and core
- Y10T 29/49117: Conductor or circuit manufacturing
- Y10T 29/49149: by metal fusion bonding
- Y10T 29/49179: by metal fusion bonding
- H01F: MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION

## Abstract

A method to produce a transponder comprises the steps of positioning a coil comprising at least one coil end in a predetermined coil position and holding all of said coil ends in a respective holding position, and holding a chip comprising at least one contact pad in a chip fixture so that all of said coil ends of the coil that should be bonded to said chip are located on one side of corresponding contact pads of the chip, and bonding of the coil ends to the contact pads.

## Claims

### Claim 1

Method to produce a transponder, comprising:
position a coil comprising first and second coil ends in a predetermined coil position and holding said coil ends in a first holding position with a first and a second wire holder;
feeding a chip comprising first and second contact pads to a chip fixture after positioning the coil in the predetermined position;
moving said chip fixture in which said chip is loaded from a chip loading position to a chip bonding position into the vicinity of the coil so that the first contact pad of the chip is positioned under the first coil end;
catching the second coil end and repositioning and stretching the second coil end above the second contact pad of the chip with a wirecatcher and fixing the second coil end in a third wire holder at a respective second holding position; and
bonding the first coil end to the first contact pad and the second coil end to the second contact pad.

### Claim 2 (depends on 1)

Method to produce a transponder according to claim 1, further comprising stretching the first coil end using a tension arm during, or after, the chip fixture is moving from the chip loading position to the chip bonding position.

### Claim 3 (depends on 1)

Method to produce a transponder according to claim 1, further comprising cutting off the second coil end after the wirecatcher has caught the second coil end so that the second coil end is cut between the wirecatcher and the second wire holder.