# US 7,609,566 B2 · Semiconductor memory device

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- Number: US 7,609,566 B2
- Document ID: US7609566B2
- Status: Granted
- Kind: B2
- Application number: 11/819,804
- Filed: 2007-06-29
- Published: 2008-07-03
- Granted: 2009-10-27
- Earliest claimed: 2007-01-03
- Assignees: Hynix Semiconductor Inc.
- Inventors: Jae-Hyuk Im
- Web page: https://patentgrep.com/patent/US7609566B2

## CPC

- G11C 5/145: {Applications of charge pumps; Boosted voltage circuits; Clamp circuits therefor (G11C5/141 takes precedence)}
- G11C 11/4074: Power supply or voltage generation circuits, e.g. bias voltage generators, substrate voltage generators, back-up power, power control circuits
- G11C 29/021: {in voltage or current generators}
- G11C 29/028: {with adaption or trimming of parameters}
- G11C 11/401: forming cells needing refreshing or charge regeneration, i.e. dynamic cells
- G11C 2211/4067: Refresh in standby or low power modes
- G11C 2211/4068: Voltage or leakage in refresh operations
- G11C: STATIC STORES (semiconductor memory devices H10B)

## Abstract

A semiconductor memory device includes a charge pumping circuit, a level sensor, an oscillator, and a pumping control signal generator. The charge pumping circuit performs a negative-pumping operation to an external power in order to generate an internal voltage having a level lower than the external power. The level sensor senses a level of the internal voltage corresponding to a level of an adjusted reference voltage during a refresh mode. The oscillator generates a period signal in response to a sensing signal of the level sensor. The pumping control signal generator controls the operation of the charge pumping circuit in response to the period signal.

## Claims

### Claim 1

A semiconductor memory device, comprising:
a charge pumping circuit for negative-pumping an external power to generate an internal voltage with a level lower than the external power;
a level sensor for receiving a self refresh signal and sensing a level of the internal voltage corresponding to a level of an adjusted reference voltage during a refresh mode;
an oscillator for generating a period signal in response to a sensing signal of the level sensor; and
a pumping control signal generator for controlling the operation of the charge pumping circuit in response to the period signal.

### Claim 2 (depends on 1)

The semiconductor memory device as recited in claim 1, wherein the level sensor includes:
a feedback circuit for providing a level of the internal voltage on the basis of the level of the adjusted reference voltage as a feedback voltage;
a level controller for providing control signals for controlling a level of the feedback voltage during the refresh mode; and
a differential amplifier for taking the feedback voltage and its inverted feedback voltage as differential inputs to output the sensing signal.

### Claim 3 (depends on 2)

The semiconductor memory device as recited in claim 2, wherein the level controller includes:
a first NAND gate taking a self refresh interval signal as the self refresh signal and a first level adjustment signal;
a first inverter for inverting an output signal of the first NAND gate to output a down-control signal;
a second NAND gate taking the self refresh interval signal and a second level adjustment signal; and
a second inverter for inverting an output signal of the second NAND gate to provide an up-control signal.

### Claim 4 (depends on 3)

The semiconductor memory device as recited in claim 3, wherein the first and the second level adjustment signals are selected so that a leakage current is minimized in a test step of wafer level, and set by a fuse option or a metal option.

### Claim 5 (depends on 4)

The semiconductor memoiy device as recited in claim 4, wherein the feedback circuit includes:
first to fourth PMOS transistors whose each gate takes a ground voltage and which are connected in series between a reference voltage and an output node;
fifth to eighth PMOS transistors whose each gate takes the internal voltage and which are connected in series between the output node and the ground voltage;
a first NMOS transistor whose gate receives the down-control signal and which is connected in parallel with the first PMOS transistor; and
a second NMOS transistor whose gate accepts the up-control signal and which is connected in parallel with the eighth PMOS transistor.

### Claim 6 (depends on 5)

The semiconductor memory device as recited in claim 5, further comprising a reference voltage generator for generating the reference voltage having a stable level regardless of the external power.

### Claim 7

A driving method of a semiconductor memory device, comprising:
performing negative-pumping operation to an external power in order to generate a bulk voltage of memory cell;
sensing a level of the bulk voltage in response to an adjusted reference voltage; and
controlling the negative-pumping operation so that the bulk voltage has a level corresponding to the adjusted reference voltage,
wherein the adjusted reference voltage has a different voltage level for a self refresh mode than a level of the reference voltage for a normal mode.

### Claim 8 (depends on 7)

The driving method as recited in claim 7, wherein sensing the level of the bulk voltage includes:
dividing a voltage difference between the bulk voltage and the adjusted reference voltage to produce a feedback voltage;
adjusting a level of the feedback voltage during the self refresh mode; and
generating a sensing signal depending on the level of the feedback voltage.

### Claim 9 (depends on 8)

The driving method as recited in claim 8, wherein controlling the negative-pumping operation is perfonned by repeating the negative-pumping operation while the sensing signal is enabled.
