# US 7,609,524 B2 · Package structure for panel module and method using the same

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- Number: US 7,609,524 B2
- Document ID: US7609524B2
- Status: Granted
- Kind: B2
- Application number: 11/550,834
- Filed: 2006-10-19
- Published: 2007-12-13
- Granted: 2009-10-27
- Earliest claimed: 2006-06-08
- Assignees: Au Optronics Corporation
- Inventors: Chung-Kuan Ting; Shih-Chi Chen; Wen-Yuan Chang; Chia-Chung Wu
- Web page: https://patentgrep.com/patent/US7609524B2

## CPC

- H05K 7/1417: {having securing means for mounting boards, plates or wiring boards (H05K7/1461 takes precedence)}
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS

## Abstract

A package structure for packaging a panel module. The panel module comprises at least a gap. The package structure comprises a base and a cover. The base comprises a first loading surface for loading the panel module and at least one first engaging portion corresponding to the gap. The cover comprises a first covering surface and a second engaging portion corresponding to the first engaging portion. The first engaging portion and the second engaging portion connect the first loading surface and the first covering surface.

## Claims

### Claim 1

A package structure for loading a panel module, wherein the panel module comprises a substrate, a circuit module, and a flexible printed circuit board connected to the substrate and the circuit module, at least one gap being formed between the substrate, the circuit module, and the flexible printed circuit board, the package structure comprising:
a base having a first loading surface, and a depression area on the first loading surface for loading the panel module;
at least one first engaging portion on the first loading surface disposed corresponding to the gap;
a cover having first covering surface; and
a second engaging portion formed on the cover and corresponding to the first engaging portion;
a connecting bar passing through the base and the cover via the first engaging portion and the second engaging portion, wherein the first engaging portions and the second engaging portions are holes.

### Claim 2 (depends on 1)

The package structure as claimed in claim 1, wherein the base further has a second covering surface is disposed on the reverse of the first loading surface of the cover.

### Claim 3 (depends on 1)

The package structure as claimed in claim 1, wherein the cover further has a second loading surface is disposed on the reverse the first covering surface of the cover.

### Claim 4 (depends on 1)

The package structure as claimed in claim 1, further comprising at least one cushion disposed between the cover and the panel module.

### Claim 5 (depends on 4)

The package structure as claimed in claim 4, wherein the cushion is made of plastic foam.