# US 7,609,520 B2 · Heat spreader with vapor chamber defined therein > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 7,609,520 B2 - Document ID: US7609520B2 - Status: Granted - Kind: B2 - Application number: 11/752,909 - Filed: 2007-05-23 - Published: 2008-07-24 - Granted: 2009-10-27 - Earliest claimed: 2007-05-23 - Assignees: Foxconn Technology Co., Ltd. - Inventors: Chang-Shen Chang; Juei-Khai Liu; Chao-Hao Wang; Hsien-Sheng Pei - Web page: https://patentgrep.com/patent/US7609520B2 ## CPC - F28D 15/0233: {the conduits having a particular shape, e.g. non-circular cross-section, annular (F28D15/0241, F28D15/0266 take precedence)} - F28D 15/046: {characterised by the material or the construction of the capillary structure} - H10W 40/25: characterised by their materials - H10W 40/73: for cooling by change of state - F28D: HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT (fluid heaters having heat generating means and heat transferring means F24H; furnaces F27; details of heat-exchange apparatus of general) - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract A heat spreader includes a bottom wall (12) and a cover (14) hermetically connected to the bottom wall. Cooperatively the bottom wall and the cover define a space (11) therebetween for receiving a working fluid therein. A wick structure (15) is received in the space and thermally interconnects the bottom wall and the cover. The wick structure includes at least a carbon nanotube array, which can conduct heat from the bottom wall to the cover and draw condensed liquid of the working fluid from the cover toward the bottom wall. ## Claims ### Claim 1 A heat spreader, comprising: a bottom wall; a cover hermetically connected to the bottom wall to thereby form a sealed space which contains working liquid therein; and a wick structure received in the space and thermally interconnecting the bottom wall and the cover; wherein the wick structure comprises a plurality of carbon nanotube arrays being evenly spaced from each other; and wherein a first channel is defined between each two neighboring carbon nanotube arrays, and a second channel is defined at each of two opposite sides of the carbon nanotube arrays, the second channel being perpendicular to and communicating with the first channel. ### Claim 2 (depends on 1) The heat spreader of claim 1, further comprising another wick structure formed on inner surfaces of the bottom wall and the cover. ### Claim 3 (depends on 2) The heat spreader of claim 2, wherein the cover and bottom wall are made of copper, and the another wick structure comprises at least a carbon nanotube array formed on the cover and the bottom wall of the heat spreader directly. ### Claim 4 (depends on 2) The heat spreader of claim 2, wherein the another wick structure has one of the following four configurations: sintered powder, grooves, fibers and screen meshes. ### Claim 5 (depends on 1) The heat spreader of claim 1, wherein the cover includes a top wall, a side wall extending substantially perpendicularly from the top wall, and a flange extending transversely and outwardly from a free end of the side wall, the flange of the cover and an outer periphery of the bottom wall being connected together by a soldering process to hermetically connect the cover to the bottom wall. ### Claim 6 A cooling device, comprising: a heat spreader for thermally attaching to a heat-generating device, comprising: a bottom wall; a cover hermetically connected to the bottom wall to thereby form a sealed space for containing working liquid therein; and a wick structure received in the space and thermally interconnecting the bottom wall and the cover; and a heat sink being thermally mounted on the heat spreader; wherein the wick structure comprises a plurality of carbon nanotube arrays being evenly spaced from each other; and wherein a first channel is defined between each two neighboring carbon nanotube arrays, and a second channel is defined at each of two opposite sides of the carbon nanotube arrays, the second channel being perpendicular to and communicating with the first channel. ### Claim 7 (depends on 6) The cooling device of claim 6, further comprising another wick structure formed on inner surfaces of the bottom wall and the cover. ### Claim 8 (depends on 7) The cooling device of claim 7, wherein the cover and the bottom wall are made of copper, and the another wick structure comprises at least a carbon nanotube array formed on the cover and the bottom wall of the heat spreader directly. ### Claim 9 (depends on 7) The cooling device of claim 7, wherein the another wick structure has one of the following four configurations: sintered powder, grooves, fibers and screen meshes. ### Claim 10 (depends on 6) The cooling device of claim 6, wherein the cover includes a top wall, a side wall extending substantially perpendicularly from the top wall, and a flange extending transversely and outwardly from a free end of the side wall, the flange of the cover and an outer periphery of the bottom wall being connected together by a soldering process to hermetically connect the cover to the bottom wall. ### Claim 11 A cooling device comprising: a bottom wall having a bottom surface thermally connecting with a heat-generating electronic component; a cover hermetically connected to the bottom wall and defining an inner space with the bottom wall; liquid received in the inner space, wherein the liquid evaporates into vapor when the bottom wall receives heat from the heat-generating electronic component; and carbon nanotubes received in the inner space, thermally interconnecting the bottom wall and the cover and functioning as first wick structure drawing condensed liquid formed by the vapor from the cover toward the bottom wall; wherein the carbon nanotubes are divided into a plurality of arrays with a first channel defined between each two neighboring arrays and a second channel at each of opposite sides of the arrays, the first channel communicating with the second channel. ### Claim 12 (depends on 11) The cooling device of claim 11, wherein the carbon nanotubes are divided into a plurality of arrays, and at least one of the cover and the bottom wall is attached with a second wick structure in the inner space. ### Claim 13 (depends on 12) The cooling device of claim 12, wherein the second wick structure is made of one of the following structures: sintered powder, grooves, fibers and screen meshes. ### Claim 14 (depends on 12) The cooling device of claim 12, wherein the second wick structure is made of carbon nanotubes. ### Claim 15 (depends on 11) The cooling device of claim 11, wherein the second channels is perpendicular to the first channel.