# US 7,609,504 B2 · High-dielectric constant metal-ceramic-polymer composite material and method for producing embedded capacitor using the same > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 7,609,504 B2 - Document ID: US7609504B2 - Status: Granted - Kind: B2 - Application number: 11/358,087 - Filed: 2006-02-22 - Published: 2006-10-05 - Granted: 2009-10-27 - Earliest claimed: 2005-04-01 - Assignees: Samsung Electro-Mechanics Co., Ltd. - Inventors: Eun Tae Park; Jeong Joo Kim; Hee Young Lee; Eun Sub Lim; Jong Chul Lee; Yul Kyo Chung - Web page: https://patentgrep.com/patent/US7609504B2 ## CPC - H05K 1/162: {incorporating printed capacitors} - H01G 4/206: {inorganic and synthetic material} - H05K 2201/0209: Inorganic, non-metallic particles - H05K 2201/0215: Metallic fillers - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - H01G: CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE (selection of specified materials as dielectric H01B3/00; capacitors having potential barriers H10D1/62, H10K10/10) ## Abstract The invention relates to a high-dielectric constant metal/ceramic/polymer composite material and a method for producing an embedded capacitor. As ceramic particles having a relatively small size are bound to the surface of metal particles having a relatively large size by mixing, the occurrence of percolation can be prevented without coating the metal particles, and at the same time, the capacitance of an embedded capacitor can be increased. In addition, a process for coating the surface of the metal particles can be omitted, thus contributing to the simplification of the overall preparation procedure. ## Claims ### Claim 1 A composite dielectric material comprising a resin, metal particles and ceramic particles wherein the metal particles have an average diameter of 0.1-7.5 μm and the ceramic particles have an average diameter of below 50% of that of the metal particles, and wherein the ceramic particles are bound to the surface of the metal particles. ### Claim 2 (depends on 1) The composite dielectric material according to claim 1, wherein the metal particles have a rough surface and a surface roughness of 0.01 to 0.5 microns. ### Claim 3 (depends on 1) The composite dielectric material according to claim 1, wherein the metal is selected from the group consisting of Cu, Ni, Ag, Al, Zn, Co, Fe, Cr, Mn, and mixtures thereof. ### Claim 4 (depends on 1) The composite dielectric material according to claim 1, wherein the ceramic particles are particles of at least one ferroelectric material selected from the group consisting of BaTiO3, PbTiO3, CaTiO3, SrTiO3, PMN, PMN-PT, PZT, PZN-PT and PMT-PT. ### Claim 5 (depends on 1) The composite dielectric material according to claim 1, wherein the ceramic particles are present in an amount of 1-40% by volume. ### Claim 6 (depends on 1, 2, 3, 4, 5) A capacitor using the composite dielectric material according to any one of claims 1 to 5. ### Claim 7 (depends on 6) A multilayer printed circuit board in which the capacitor according to claim 6 is formed in a circuit. ### Claim 8 (depends on 6) A module substrate comprising the capacitor according to claim 6 embedded therein and a semiconductor chip mounted thereon. ### Claim 9 A composite dielectric material comprising a resin, metal particles in an amount of 1-30% by volume and ceramic particles, wherein the ceramic particles are bound to the surface of the metal particles. ### Claim 10 A composite dielectric material comprising a resin, metal particles and ceramic particles, wherein the ceramic particles are bound to the surface of the metal particles, and wherein the ceramic particles are doped with an additive selected from oxides (2+, 3+ and 5+) of Mn, Mg, Sr, Ca, Y and Nb, oxides of lanthanide elements Ce, Dy, Ho, Yb and Nd, and mixtures thereof. ### Claim 11 A method for preparing a composite dielectric material by mixing 1-30% by volume of metal particles and 1-40% by volume of ceramic particles in 30-98% by volume of a resin, and ball milling the mixture to bind the ceramic particles having a relatively low ductility to the metal particles have a relatively high ductility. ### Claim 12 (depends on 11) The method according to claim 11, wherein the resin is selected from polymethylmethacrylate (PMMA), epoxy resins, bisphenol A type epoxy resins, novolac type epoxy resins, polyfunctional epoxy resins, and combinations thereof. ### Claim 13 (depends on 11) The method according to claim 11, wherein the metal is selected from the group consisting of Cu, Ni, Ag, Al, Zn, Co, Fe, Cr, Mn, and mixtures thereof. ### Claim 14 (depends on 11) The method according to claim 11, wherein the ceramic particles are particles of at least one ferroelectric material selected from the group consisting of BaTiO3, PbTiO3, CaTiO3, SrTiO3, PMN, PMN-PT, PZT, PZN-PT, and PMT-PT. ### Claim 15 (depends on 11) The method according to claim 11, wherein the metal particles have an average diameter of 0.1-7.5 μm and the ceramic particles have an average diameter below 50% of that of the metal particles. ### Claim 16 Composite dielectric material comprising 1-30% by volume of metal particles and 1-40% by volume of ceramic particles in 30-98% by volume of a resin, wherein the ceramic particles are bound to the surface of the metal particles. ### Claim 17 (depends on 16) The composite dielectric material according to claim 16, wherein the metal particles have a rough surface and a surface roughness of 0.01 to 0.5 microns. ### Claim 18 (depends on 16) The composite dielectric material according to claim 16, wherein the metal is selected from the group consisting of Cu, Ni, Ag, Al, Zn, Co, Fe, Cr, Mn, and mixtures thereof. ### Claim 19 (depends on 16) The composite dielectric material according to claim 16, wherein the metal particles are present in an amount of 1-30% by volume. ### Claim 20 (depends on 16) The composite dielectric material according to claim 16, wherein the ceramic particles are particles of at least one ferroelectric material selected from the group consisting of BaTiO3, PbTiO3, CaTiO3, SrTiO3, PMN, PMN-PT, PZT, PZN-PT and PMT-PT. ### Claim 21 (depends on 16) The composite dielectric material according to claim 16, wherein the ceramic particles are doped with an additive selected from oxides (2+, 3+, and 5+) of Mn, Mg, Sr, Ca, Y and Nb, oxides of lanthanide elements Ce, Dy, Ho, Yb and Nd, and mixtures thereof. ### Claim 22 (depends on 16) The composite dielectric material according to claim 16, wherein the ceramic particles are present in an amount of 1-40% by volume. ### Claim 23 (depends on 16) The composite dielectric material according to claim 16, wherein the metal particles have an average diameter of 0.1-7.5 μm and the ceramic particles have an average diameter below 50% of that of the metal particles. ### Claim 24 (depends on 16) A capacitor using the composite dielectric material according to claim 16. ### Claim 25 (depends on 24) A multilayer printed circuit board in which the capacitor according to claim 24 is formed in a circuit. ### Claim 26 (depends on 24) A module substrate comprising the capacitor according to claim 24 embedded therein and a semiconductor chip mounted thereon.