# US 7,609,501 B2 · Manufacture including shield structure > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 7,609,501 B2 - Document ID: US7609501B2 - Status: Granted - Kind: B2 - Application number: 12/017,020 - Filed: 2008-01-19 - Published: 2008-07-03 - Granted: 2009-10-27 - Earliest claimed: 1997-04-08 - Assignees: X2Y Attenuators, LLC - Inventors: Anthony A. Anthony; William M. Anthony - Web page: https://patentgrep.com/patent/US7609501B2 ## CPC - H10W 70/685: comprising multiple insulating layers - H05K 1/023: {using auxiliary mounted passive components or auxiliary substances (printed passive components H05K1/16)} - H10W 42/20: protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons - H10W 44/20: at high-frequency [HF] or radio frequency [RF] - H10W 70/65: Shapes or dispositions of interconnections - H10W 72/00: Interconnections or connectors in packages - H05K 1/0237: {High frequency adaptations (H05K1/0216 takes precedence)} - H05K 2201/09236: Parallel layout - H05K 2201/10378: Interposers - H10W 72/90: Bond pads, in general - H10W 72/9415: {relative to the surface, e.g. recessed, protruding} - H10W 72/9445: {Top-view layouts, e.g. mirror arrays} - H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL} - H10W 90/728: {between a chip and a stacked discrete passive device, e.g. resistors, capacitors or inductors} - Y10T 29/49124: On flat or curved insulated base, e.g., printed circuit, etc. - Y10T 29/4913: Assembling to base an electrical component, e.g., capacitor, etc. - Y10T 29/49204: Contact or terminal manufacturing - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION ## Abstract The present invention relates to an interposer substrate for interconnecting between active electronic componentry such as but not limited to a single or multiple integrated circuit chips in either a single or a combination and elements that could comprise of a mounting substrate, substrate module, a printed circuit board, integrated circuit chips or other substrates containing conductive energy pathways that service an energy utilizing load and leading to and from an energy source. The interposer will also possess a multi-layer, universal multi-functional, common conductive shield structure with conductive pathways for energy and EMI conditioning and protection that also comprise a commonly shared and centrally positioned conductive pathway or electrode of the structure that can simultaneously shield and allow smooth energy interaction between grouped and energized conductive pathway electrodes containing a circuit architecture for energy conditioning as it relates to integrated circuit device packaging. The invention can be employed between an active electronic component and a multilayer circuit card. A method for making the interposer is not presented and can be varied to the individual or proprietary construction methodologies that exist or will be developed. ## Claims ### Claim 1 A manufacture, comprising: a conductive structure, said conductive structure including conductive material forming a first shield structure, wherein said first shield structure includes a first shield structure upper layer; a first shield structure lower layer below and opposing at least part of said first shield structure upper layer; and a first conductive pathway between opposing portions of said first shield structure upper layer and said first shield structure lower layer, said first conductive pathway conductively connecting said first shield structure upper layer to said first shield structure lower layer; a first electrode having a first electrode inner portion between said first shield structure upper layer and said first shield structure lower layer; a second electrode having a second electrode inner portion between said first shield structure upper layer and said first shield structure lower layer; wherein said first electrode inner portion and said second electrode inner portion are conductively isolated from said conductive structure; and wherein said first electrode inner portion and said second electrode inner portion are conductively isolated from one another in said first shield structure. ### Claim 2 (depends on 1) The manufacture of claim 1 wherein said conductive structure further comprises a first shield structure middle layer between said first shield structure upper layer and said first shield structure lower layer, wherein said first shield structure middle layer is conductively connected to said conductive structure. ### Claim 3 (depends on 2) The manufacture of claim 2 wherein said first conductive pathway physically contacts said first shield structure middle layer. ### Claim 4 (depends on 2) The manufacture of claim 2 wherein said first electrode inner portion is below said first shield structure middle layer and said second electrode portion is above said first shield structure middle layer. ### Claim 5 (depends on 1) The manufacture of claim 1 comprising an integrated circuit. ### Claim 6 (depends on 5) The manufacture of claim 5 wherein said integrated circuit comprises silicon. ### Claim 7 (depends on 5) The manufacture of claim 5 wherein first electrode forms part of a first data communication line of said integrated circuit. ### Claim 8 (depends on 7) The manufacture of claim 7 wherein said second electrode forms part of a second data communication line of said integrated circuit. ### Claim 9 (depends on 2) The manufacture of claim 2 comprising an integrated circuit, said integrated circuit incorporating said conductive structure. ### Claim 10 (depends on 3) The manufacture of claim 3 comprising an integrated circuit, said integrated circuit incorporating said conductive structure. ### Claim 11 (depends on 4) The manufacture of claim 4 comprising an integrated circuit, said integrated circuit incorporating said conductive structure. ### Claim 12 (depends on 1) The manufacture of claim 1 wherein said first electrode inner portion defines an aperture through which said first conductive pathway extends. ### Claim 13 (depends on 2) The manufacture of claim 2 wherein said second electrode inner portion defines an aperture through which said first conductive pathway extends. ### Claim 14 (depends on 1) The manufacture of claim 1: wherein said conductive structure includes structure forming a second shield structure; wherein said second shield structure includes a second shield structure upper layer, a second shield structure lower layer below and opposing at least part of said second shield structure upper layer; and a second conductive pathway between opposing portions of said second shield structure upper layer and said second shield structure lower layer; wherein said second conductive pathway conductively connects said second shield structure upper layer to said second shield structure lower layer; wherein said second shield structure is stacked above said first shield structure; and wherein said second shield structure is conductively connected to said first shield structure. ### Claim 15 (depends on 14) The manufacture of claim 14 wherein said second shield structure lower layer and said first shield structure upper layer are formed from the same layer of conductive material. ### Claim 16 (depends on 14) The manufacture of claim 14 wherein said second conductive pathway is aligned with said first conductive pathway. ### Claim 17 (depends on 1) The manufacture of claim 1 further comprising at least one additional conductive pathway that conductively connects said first shield structure upper layer to said first shield structure lower layer. ### Claim 18 (depends on 1) An interposer incorporating the manufacture of claim 1. ### Claim 19 (depends on 1) The manufacture of claim 1 wherein said first conductive pathway extends to a conductive pad. ### Claim 20 (depends on 19) The manufacture of claim 19 further comprising a support structure supporting said conductive pad, and wherein said first conductive pathway is bonded to said conductive pad. ### Claim 21 (depends on 1) The manufacture of claim 1: wherein said first shield structure upper layer is separated from said first electrode inner portion by a first distance in a direction perpendicular to the plane of said first shield structure upper layer; and wherein said first shield structure upper layer extends in a dimension in the plane of the first shield structure upper layer beyond the extent of the first electrode inner portion by a distance that is greater than said first distance. ### Claim 22 (depends on 5) The manufacture of claim 5 wherein said integrated circuit incorporates said conductive structure. ### Claim 23 (depends on 3) The manufacture of claim 3 comprising an integrated circuit. ### Claim 24 (depends on 23) The manufacture of claim 23 wherein said integrated circuit incorporates said conductive structure.