# US 7,609,461 B1 · Optical module having cavity substrate

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- Number: US 7,609,461 B1
- Document ID: US7609461B1
- Status: Granted
- Kind: B1
- Application number: 11/315,994
- Filed: 2005-12-21
- Granted: 2009-10-27
- Earliest claimed: 2001-01-16
- Assignees: Amkor Technology, Inc.
- Inventors: Steven Webster; Thomas P. Glenn; Roy Dale Hollaway
- Web page: https://patentgrep.com/patent/US7609461B1

## CPC

- H10F 39/804: {Containers or encapsulations}
- G02B 7/02: for lenses {(supports for magnifying lenses G02B25/002)}
- H04N 23/54: Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
- H04N 23/55: Optical parts specially adapted for electronic image sensors; Mounting thereof
- H04N 23/57: Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
- H10F 39/024: {of coatings or optical elements}
- H10F 39/026: {Wafer-level processing}
- H10F 39/806: {Optical elements or arrangements associated with the image sensors}
- H10F 77/407: {indirectly associated with the devices}
- H10F 77/50: Encapsulations or containers (for photovoltaic modules H10F19/80)
- H10W 70/682: {comprising holes having chips therein}
- H10W 72/0198: {batch processes}
- H10W 72/884: {Die-attach connectors and bond wires}
- H10W 90/734: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W 90/754: {between a chip and a stacked insulating package substrate, interposer or RDL}
- Y10T 29/49128: Assembling formed circuit to base
- Y10T 29/4913: Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T 29/49146: with encapsulating, e.g., potting, etc.
- Y10T 29/49787: Obtaining plural composite product pieces from preassembled workpieces
- H10F: INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- G02B: OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- H04N: PICTORIAL COMMUNICATION, e.g. TELEVISION
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION

## Abstract

A method of forming an optical module includes mounting an image sensor to a base of a substrate and bonding a lens housing to a sidewall of the substrate. A mounting surface of the lens housing includes a locking feature having a horizontal surface and a vertical surface. The sidewall of the substrate includes a joint surface. To bond the lens housing to the sidewall of the substrate, a bond is formed between the horizontal surface of the locking feature of the lens housing and the joint surface of the sidewall. Further, a bond is formed between the vertical surface of the locking feature of the lens housing and an interior surface of the sidewall.

## Claims

### Claim 1

An optical module comprising:
a substrate comprising:
a cavity;
a first interior surface;
a second interior surface formed around a periphery of the first interior surface and extending in a first direction from the first interior surface; and
a joint surface extending from the second interior surface;
an image sensor coupled in the cavity to the substrate, the image sensor being coupled to the first interior surface with an adhesive;
a lens housing coupled to the substrate, wherein the lens housing comprises a mounting surface comprising:
a first surface coupled to the joint surface; and
a second surface coupled to the second interior surface of the substrate; and
an electronic component on a first exterior surface of the substrate.

### Claim 2 (depends on 1)

The optical module of claim 1 wherein the substrate comprises a cup shaped enclosure.

### Claim 3 (depends on 1)

The optical module of claim 1 wherein a first surface of the image sensor is coupled to the first interior surface of the substrate with the adhesive.

### Claim 4 (depends on 3)

The optical module of claim 3 wherein the image sensor comprises:
a second surface;
an active area on the second surface; and
bond pads on the second surface.

### Claim 5 (depends on 4)

The optical module of claim 4 further comprising:
interior traces on the first interior surface of the substrate; and
bond wires electrically coupling the bond pads to the interior traces.

### Claim 6 (depends on 5)

The optical module of claim 5 further comprising electrically conductive vias electrically coupled to the interior traces, the vias extending through the substrate from the first interior surface to the first exterior surface of the substrate.

### Claim 7 (depends on 6)

The optical module of claim 6 further comprising exterior traces on the first exterior surface of the substrate, the exterior traces being electrically coupled to the vias.

### Claim 8 (depends on 7)

The optical module of claim 7 wherein the exterior traces extend along a second exterior surface of the substrate.

### Claim 9 (depends on 5)

The optical module of claim 5 further comprising electrically conductive pads on the first exterior surface of the substrate, the pads being electrically coupled to the interior traces.

### Claim 10 (depends on 5)

The optical module of claim 5 further comprising electrically conductive interconnection balls on the first exterior surface of the substrate, the interconnection balls being electrically coupled to the interior traces.

### Claim 11 (depends on 4)

The optical module of claim 4 wherein the lens housing comprises an internal cylindrical surface comprising a longitudinal axis perpendicular to the second surface of the image sensor.

### Claim 12 (depends on 11)

The optical module of claim 11 wherein the internal cylindrical surface defines a central aperture, the optical module further comprising:
a lens support in the central aperture; and
an optical element coupled to the lens support.

### Claim 13 (depends on 1)

The optical module of claim 1 further comprising an image sensor substrate comprising a plurality of substrates coupled together, the plurality of substrates comprising the substrate.

### Claim 14 (depends on 1)

The optical module of claim 1 wherein the substrate is integral.

### Claim 15 (depends on 1)

The optical module of claim 1 further comprising a second adhesive, the mounting surface being coupled to the joint surface by the second adhesive.

### Claim 16 (depends on 1)

The optical module of claim 1 wherein the lens housing comprises a mounting rim comprising the mounting surface.